Results 101 to 110 of about 3,180,850 (297)

Silicon‐Embedded Multifunctional Heterogeneous Integration for Miniaturized Photoplethysmography Detection Devices

Advanced Science, EarlyView.
ABSTRACT The multifunctional integration of chips with high flexibility and scalable manufacturing is crucial for enhancing chip performance, reducing chip size, and simplifying chip design. However, balancing volume, cost, flexibility, and functionality using traditional heterogeneous integration methods is challenging.
Lang Chen, Shizun Hu, Zhou Yang, Shitao Shen, Pan Zhang, Han Xu, Chi Zhang, Wei Wang   +7 more
wiley   +1 more source

Recent Progress in Metallurgical Bonding Mechanisms at the Liquid/Solid Interface of Dissimilar Metals Investigated via in situ X-ray Imaging Technologies

Acta Metallurgica Sinica, 2021
Zong-ye Ding, Naifang Zhang, Liao Yu, Wenquan Lu, Jianguo Li, Q. Hu   +5 more
semanticscholar   +1 more source

Mixing‐Driven Defects and Composition Evolution in Multi‐Material Metal Additive Manufacturing

Advanced Science, EarlyView.
Operando synchrotron X‐ray imaging coupled with high‐fidelity multiphysics modeling uncovers how inter‐material mixing reshapes keyhole dynamics and drives distinct pore‐formation pathways in multi‐material laser powder bed fusion (LPBF). Composition‐dependent instabilities trigger defects, whereas rescanning suppresses porosity and homogenizes Cu ...
Zhilang Zhang, Steve Gaudez, Mario Togni, Steven Van Petegem, Markus Bambach, Mamzi Afrasiabi   +5 more
wiley   +1 more source

Neuromorphic Near‐Sensor and In‐Sensor Computing Enabled by Next‐Generation Material‐Based Sensors

Advanced Science, EarlyView.
This Review presents a structural framework that classifies neuromorphic sensing into near‐sensor and in‐sensor architectures, clarifying physical coupling between sensing and computation. The framework connects neural and synaptic device functions with recent advances in optical, mechanical, and chemical sensing, compares energy consumption and ...
Su Yeon Jung, Gwang Ya Kim, Sejin Kim, Hyunjong Seo, Se Gi Lee, Sang Min Won, Dongjoon Rhee, Joohoon Kang   +7 more
wiley   +1 more source

Controllable Carbon Shell Encapsulation via Rapid Joule Heating Calcination for High‐Performance Asymmetric Supercapacitor With Suppressed Self‐Discharge and Robust Cycling Stability

Advanced Science, EarlyView.
The H‐Fe3O4@C negative electrode and H‐NiCo2S4@C positive electrode are designed through a controllable carbon shell encapsulation strategy. The as‐constructed asymmetric supercapacitor presents robust cycling stability with 93.7% capacity retention after 25 000 cycles.
Qiang Zhou, Zheng Yang, Zhen Cao, Xulan Zheng, Xiao Yan, Yunsong Li, Xinsheng Zhao, Yuxiao Lin, Xiaoxiao Li   +8 more
wiley   +1 more source

Interface Control in Additive Manufacturing of Dissimilar Metals Forming Intermetallic Compounds-Fe-Ti as a Model System. [PDF]

Materials (Basel), 2020
Cui D, Mohanta A, Leparoux M.
europepmc   +1 more source

Effect of preheating temperature on post-weld residual stress of dissimilar steel plates

Metalurgija, 2020
Based on the numerical simulation software Visual-Environment, the numerical calculation and analysis of residual stress field under different preheating temperatures for Q345/2Cr13 dissimilar plate welding were carried out in this paper.
H. Fu, B. Xu, Q. Xiao, S. Li, X. Zhang, S. Bian, T. Kang   +6 more
doaj  

Stepwise Engineering of Van der Waals Heterostructures for High Current Density in Light Emitting Devices

Advanced Electronic Materials, EarlyView.
A novel strategy for achieving high current density in van der Waals (vdW) heterostructure‐based light‐emitting devices (LEDs) is proposed. Based on this concept, an LED utilizing a WS2/WSe2 heterostructure was fabricated, achieving a current density of 9.4 × 104 A/cm2.
Rei Usami, Koshi Oi, Keisuke Yamada, Jiang Pu, Hao Ou, Takahiko Endo, Yasumitsu Miyata, Taishi Takenobu   +7 more
wiley   +1 more source

Microstructural features and mechanical properties of in-situ remelting welding of TC4 titanium alloy and T2 copper welded joint by electron beam

Journal of Materials Research and Technology
In order to achieve high-quality welding of titanium copper dissimilar metals, the in-situ remelting welded joints of TC4 and T2 were obtained by using a time-sharing dual electron beam(TDEB).
Jie Zhou, Shun Guo, Zehaochen Deng, Yong Peng, Qi Zhou, Huning Bi, Kailei Zhao, Hongyi Xu, Kehong Wang   +8 more
doaj   +1 more source

Improved Direct Ink Writing of Liquid Metal Foams via Liquid Additives

Advanced Electronic Materials, EarlyView.
The ability to pattern liquid metal is useful for making soft electrical and thermal devices. Dispensing liquid metal from a nozzle naturally results in the formation of spheroidal droplets, making direct‐write printing challenging. Liquid metal foams containing pockets of air can extrude as filaments, albeit inconsistently.
Febby Krisnadi, Tushar Sakorikar, Man Hou Vong, Michael D. Dickey   +3 more
wiley   +1 more source