Results 251 to 260 of about 111,583 (395)
Advanced Engineering Materials, EarlyView.Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke +3 more
wiley +1 more source
Programmable Reconfiguration of Hybrid 4D Chiral Metamaterials via Mechanical and Thermal Stimuli
Advanced Engineering Materials, EarlyView.A class of hybrid chiral mechanical metamaterials is designed to achieve programmable reconfiguration through soft networks, hinges, and bilayer joints integrated with rigid units. Responsive to mechanical and thermal stimuli, these structures exhibit large volume changes, tunable deformation pathways, and both positive and negative thermal expansion ...
Yunyao Jiang, Siyao Liu, Yaning Li
wiley +1 more source
Postage Stamp Precision Technique of Dorsal Hump Reduction. [PDF]
Indian J Plast SurgBhat U +6 more
europepmc +1 more source
Bowen′s disease on the dorsum of hand
Indian Dermatology Online Journal, 2015 openaire +4 more sources
Advanced Functional Materials, EarlyView.Graded refractive index (GRI) structures are prepared from the layer‐by‐layer spray coating of the mesoporous SiO2 nanoparticles, showing high solar transparency and thermal emissivity. Under outdoor conditions, after 50 days, the GRI‐coated photovoltaics show on average 6.65 ± 1.48 °C lower than that of the non‐coated references, maintaining 80.9 ± 8 ...
Heesuk Jung +14 more
wiley +1 more source