Results 241 to 250 of about 669,071 (359)

Recent Advances in Atomic Force Microscopy‐Based Local Anodic Oxidation Nanolithography of 2D Materials

open access: yesAdvanced Materials Interfaces, EarlyView.
This review summarizes the development of atomic force microscopy‐based local anodic oxidation technology for patterning 2D materials, discussing its mechanisms, applications in nanolithography and device fabrication, key influencing factors, existing challenges, and future prospects in nano‐designs.
Jing Yu   +5 more
wiley   +1 more source

Aflibercept clearance through the drainage system in a rat model. [PDF]

open access: yesInt J Retina Vitreous, 2021
Keshet Y   +6 more
europepmc   +1 more source

Biocompatibility and Long‐Term Stability of DNA‐Based Organic Mixed Conductors for Bioelectronics

open access: yesAdvanced Materials Interfaces, EarlyView.
The biocompatibility and long‐term stability of DNA‐based mixed ionic‐electronic conductors are investigated. In vitro cytotoxicity and cell viability are assessed using flow cytometry assay on primary mouse fibroblasts cultures. The biocomposites are integrated into organic electrochemical transistors (OECTs) to determine the stability of their ...
Sarka Hradilova   +7 more
wiley   +1 more source

Passive or active drainage system for chronic subdural haematoma-a single-center retrospective follow-up study. [PDF]

open access: yesActa Neurochir (Wien)
Majewska P   +5 more
europepmc   +1 more source

Early experience with the Thopaz+ chest drainage system - is this a new era in the management of post-cardiotomy bleeding? [PDF]

open access: yesKardiochir Torakochirurgia Pol, 2021
Pawelkowska K   +8 more
europepmc   +1 more source

Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya   +3 more
wiley   +1 more source

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