This review summarizes the development of atomic force microscopy‐based local anodic oxidation technology for patterning 2D materials, discussing its mechanisms, applications in nanolithography and device fabrication, key influencing factors, existing challenges, and future prospects in nano‐designs.
Jing Yu+5 more
wiley +1 more source
Endoscopic Dacryocystorhinostomy Following Nasolacrimal Drainage System Trauma and Medial Orbital Wall Reconstruction. [PDF]
Turner LD+3 more
europepmc +1 more source
Aflibercept clearance through the drainage system in a rat model. [PDF]
Keshet Y+6 more
europepmc +1 more source
LONG-TERM PERFORMANCE OF ALKALINITY-PRODUCING PASSIVE SYSTEMS FOR THE TREATMENT OF MINE DRAINAGE
George R. Watzlaf+2 more
openalex +1 more source
Anomalies of cardiac venous drainage associated with abnormalities of cardiac conduction system [PDF]
David Morgan
openalex +1 more source
Biocompatibility and Long‐Term Stability of DNA‐Based Organic Mixed Conductors for Bioelectronics
The biocompatibility and long‐term stability of DNA‐based mixed ionic‐electronic conductors are investigated. In vitro cytotoxicity and cell viability are assessed using flow cytometry assay on primary mouse fibroblasts cultures. The biocomposites are integrated into organic electrochemical transistors (OECTs) to determine the stability of their ...
Sarka Hradilova+7 more
wiley +1 more source
Passive or active drainage system for chronic subdural haematoma-a single-center retrospective follow-up study. [PDF]
Majewska P+5 more
europepmc +1 more source
Early experience with the Thopaz+ chest drainage system - is this a new era in the management of post-cardiotomy bleeding? [PDF]
Pawelkowska K+8 more
europepmc +1 more source
Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya+3 more
wiley +1 more source