Results 201 to 210 of about 87,636 (284)

Lead‐Free Bismuth Halide Perovskite Memristors: Low‐Voltage Switching and Physical Modeling of Resistive Hysteresis

open access: yesAdvanced Materials Technologies, EarlyView.
Lead‐free bismuth halide perovskite memristors exhibit stable low‐voltage resistive switching behavior. The conductance‐activated quasi‐linear memristor model quantitatively reproduces the experimental hysteresis, confirming ion migration‐driven filament dynamics.
So‐Yeon Kim   +4 more
wiley   +1 more source

Microfluidic Engineering of Chitosan‐Coated Nanoemulsions for Controlled Release and Stability in Space Pharmaceutics

open access: yesAdvanced Materials Technologies, EarlyView.
Microfluidic engineering enables the fabrication of chitosan‐coated, melatonin‐loaded nanoemulsions with controlled release and enhanced physicochemical stability for space pharmaceutics. Interfacial biopolymer coating modulates droplet behavior under accelerated thermal stress and simulated microgravity.
Modupe Adebowale   +3 more
wiley   +1 more source

Crystal Growth Modulation of Tin-Lead Halide Perovskites via Chaotropic Agent. [PDF]

open access: yesJ Am Chem Soc
Dong Y   +14 more
europepmc   +1 more source

Degradation Mechanisms in PEM Water Electrolysis: Diagnosis and Impact

open access: yesAdvanced Materials Technologies, EarlyView.
This review provides an analysis of degradation mechanisms in proton electrolyte membrane water electrolyzers (PEMWE), focusing on all key components. It discusses diagnostic and measurement techniques for evaluating degradation, less‐studied mechanisms, and an expert survey.
Annik Bernhardt   +11 more
wiley   +1 more source

In Situ Copper Electroplating Turns Material Extrusion 3D Printers Into Metal–Polymer Hybrid Fabricators

open access: yesAdvanced Materials Technologies, EarlyView.
An in situ electroplating approach for MEX 3D printing is proposed, enabling copper deposition during the fabrication of conductive polymers. The method combines a printer‐integrated plating head, ML‐based g‐code control, and stop‐and‐go printing, achieving near‐bulk copper conductivity and enabling fully embedded, assembly‐free electronic components ...
Gianluca Percoco   +5 more
wiley   +1 more source

Solvent-dripping modulated 3D/2D heterostructures for high-performance perovskite solar cells. [PDF]

open access: yesNat Commun
Chang X   +22 more
europepmc   +1 more source

Adhesive Double‐Network Granular Organogel E‐Skin

open access: yesAdvanced Materials Technologies, EarlyView.
We introduce a double‐network granular organogel adhesive for electronic skin, overcoming adhesion and strength trade‐offs. It provides reversible, robust bonding and ionic conductivity, enabling wearable and soft robotic e‐skin. Thanks to the e‐skin adhesive, a soft robotic trunk can recognize touch, temperature, humidity, and acidity.
Antonia Georgopoulou   +4 more
wiley   +1 more source

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