Results 181 to 190 of about 161,559 (266)

Elastomers Combining Damping Efficiency With Rapid Recovery

open access: yesAdvanced Materials Technologies, EarlyView.
Double network granular elastomers (DNGEs) combine high energy dissipation under both cyclic loading and high impact with rapid shape recovery. 3D printing enables the production of complex, customizable structures with tailored performance. Recyclable DNGEs retain their properties over multiple recycling cycles.
Eva Baur, Alain Molleyres, Esther Amstad
wiley   +1 more source

Ductility Tuning via Cluster Network Characteristics of Porous Components

open access: yesAdvanced Materials Technologies, EarlyView.
Network optimization via cluster characteristics induced by interaction of stress concentration is proposed, demonstrating increased cluster size and dispersion in non‐uniform porous components. The optimized structures exhibit, for the first time, that enhanced ductility and damage progression is controllable through zigzag cluster network designed by
Ryota Toyoba   +4 more
wiley   +1 more source

Diversity and Functional Potential of Yeasts Inhabiting Honey Bee Drones. [PDF]

open access: yesMicroorganisms
Lapinskaitė V   +4 more
europepmc   +1 more source

Smart and Sustainable Sizing: Investigating the Sensing Behavior of Glass Fabrics Coated With Waterborne Polyurethane/Graphene Dispersions

open access: yesAdvanced Materials Technologies, EarlyView.
Waterborne polyurethane/graphene formulations are developed as piezoresistive coatings on glass fabric to enable flexible strain sensing. The graphene‐enabled conductive network provides a stable electromechanical response under cyclic compression. The coating demonstrates reliable pressure‐dependent resistance changes, highlighting its potential for ...
Vishnu Vijayan Pillai   +8 more
wiley   +1 more source

Characterization and Design Framework for Micro‐ and Nanoscale Printed Metal Interconnects in Hybrid Electronic Systems

open access: yesAdvanced Materials Technologies, EarlyView.
This work establishes a framework for high‐resolution printed interconnects by coupling e‐jet printing control, multilayer deposition, and sintering optimization. Ink properties and printing speed influence particle stacking, while different sintering atmospheres drive distinct microstructural evolution.
Kaifan Yue   +6 more
wiley   +1 more source

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