Results 191 to 200 of about 23,622 (224)

Nuclei discovered new practical insights via optimized soliton-like pulse analysis in a space fractional-time beta-derivatives equations. [PDF]

Sci Rep
Fendzi-Donfack E, Fotoula GRT, Jäntschi L, Fendzi MW, Tala-Tebue E, Nguenang JP, Pradeep J, Ghanshyam TG, Kenfack-Jiotsa A, Smerat A, Khishe M.   +10 more
europepmc   +1 more source

Embodied, visible, and courteous: exploring robotic social touch with virtual idols. [PDF]

Front Robot AI
Onishi Y, Ogawa K, Tanaka K, Nakanishi H.   +3 more
europepmc   +1 more source

First-principles investigations on the conducting photocatalytic behaviour in SrZr_xGe_1-xO₃ (x = 1, 0.96, 0.92 and 0.88). [PDF]

Sci Rep
Kumer A, Hoque KA, Chakma U, Dhara B, Alqahtani T, Al Shmrany H, Alqahtani A, Mundu MM, Uti DE.   +8 more
europepmc   +1 more source

Assignment of add–drop multiplexer (ADM) rings and digital cross-connect system (DCS) mesh in telecommunication networks

Journal of the Operational Research Society, 2001
This paper discusses a design of a hybrid ring–mesh network in a survivable communication network. Given a set of traffic demands, the problem is to assign each traffic demand to rings and mesh such that the cost of add–drop multiplexer (ADM) and digital cross-connect system (DCS) equipment required is minimized.
Lee, CY Lee, Chae Young, Koh, SJ
  +5 more sources

Drop/impact simulation and test validation of telecommunication products

ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208), 2002
Portable communication devices suffer impact-induced failure in usage. The products must pass drop/impact tests before shipment. The drop/impact performance is an important concern in product design. Due to the small size of this kind of electronic products, it is very expensive, time-consuming, and difficult to conduct drop tests to detect the failure
K. Wyatt, C.-P. Yeh, G. Song, J. Wu
openaire   +3 more sources

Board level drop test and simulation of TFBGA packages for telecommunication applications

53rd Electronic Components and Technology Conference, 2003. Proceedings., 2004
Reliabilit!- perfonnance of IC packages during drop impact is critical, especially for handheld electronic products. Currently. thcrc is no detailed test standard in the industry to advise on the procedures for board level dmp test. nor there is any model Ilia1 providcs good correlation with experimental ineasiircinents of acceleration and impact life.
Tong Yan Tee, Hun Shen Ng, E. Pek, Zhaowei Zhong, Chwee Teck Lim   +4 more
openaire   +3 more sources

Monitoring and Compensation of Optical Telecommunication Channels by using Optical Add Drop Multiplexers for Optical OFDM System

J. Opt. Commun., 2012
Kamaljit Singh Bhatia, Rajinder Singh Kaler, Tara Singh Kamal, Rajneesh Randhawa   +3 more
  +5 more sources

Testing The Connection Drop And Improving 4G Telecommunication Network And Accessing The Performance With 4G Network

2022 International Conference on Business Analytics for Technology and Security (ICBATS), 2022
S Balaji, S Stewart Kirubakaran
openaire   +2 more sources

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The flagship is dropping behind the fleet

Electronics & Communication Engineering Journal, 1994
It is ten years this year since BT was privatised, and ten years on the author takes a hard look at the facts of the UK telecommunications industry. He covers subjects which include: key issues; minority-led progress; financial realities; the US scene; broadband technologies; local distribution links; price regulation; nontechnical policy makers; and ...
openaire   +3 more sources