Results 211 to 220 of about 842,343 (263)
Extending nanoindentation testing toward extreme strain rates and temperatures for probing materials evolution at the nanoscale. [PDF]
MRS BullMerle B, Tiphéne G, Kermouche G.
europepmc +1 more source
A Novel Snow Leopard Optimization for High-Dimensional Feature Selection Problems. [PDF]
Sensors (Basel)Guo J +6 more
europepmc +1 more source
2022 International Conference on Business Analytics for Technology and Security (ICBATS), 2022 The main aim of the paper was to improve the additional highlights in the 4G organizations to oversee the downloading inactivity and to reduce the Connection Drop by reducing the Data Overlapping and loss in the data.
S Balaji, Stewart Kirubakaran S
semanticscholar +3 more sources
Journal of the Operational Research Society, 2001 Summary: This paper discusses a design of a hybrid ring-mesh network in a survivable communication network. Given a set of traffic demands, the problem is to assign each traffic demand to rings and mesh such that the cost of add/drop multiplexer (ADM) and digital cross-connect system (DCS) equipment required is minimized. This assignment problem can be
Chun‐Ying Lee, Seok‐Joo Koh
semanticscholar +5 more sources
Drop/impact simulation and test validation of telecommunication products
ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208), 2002 Portable communication devices suffer impact-induced failure in usage. The products must pass drop/impact tests before shipment. The drop/impact performance is an important concern in product design. Due to the small size of this kind of electronic products, it is very expensive, time-consuming, and difficult to conduct drop tests to detect the failure
Jing Wu +3 more
semanticscholar +4 more sources
Board level drop test and simulation of TFBGA packages for telecommunication applications
53rd Electronic Components and Technology Conference, 2003. Proceedings., 2004 Reliabilit!- perfonnance of IC packages during drop impact is critical, especially for handheld electronic products. Currently. thcrc is no detailed test standard in the industry to advise on the procedures for board level dmp test. nor there is any model Ilia1 providcs good correlation with experimental ineasiircinents of acceleration and impact life.
Tong Yan Tee +4 more
semanticscholar +4 more sources