Results 211 to 220 of about 73,181 (230)
Some of the next articles are maybe not open access.

Drop/impact simulation and test validation of telecommunication products

ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208), 2002
Portable communication devices suffer impact-induced failure in usage. The products must pass drop/impact tests before shipment. The drop/impact performance is an important concern in product design. Due to the small size of this kind of electronic products, it is very expensive, time-consuming, and difficult to conduct drop tests to detect the failure
J. Wu, G. Song, C.-P. Yeh, K. Wyatt
openaire   +1 more source

Board level drop test and simulation of TFBGA packages for telecommunication applications

53rd Electronic Components and Technology Conference, 2003. Proceedings., 2004
Reliabilit!- perfonnance of IC packages during drop impact is critical, especially for handheld electronic products. Currently. thcrc is no detailed test standard in the industry to advise on the procedures for board level dmp test. nor there is any model Ilia1 providcs good correlation with experimental ineasiircinents of acceleration and impact life.
null Tong Yan Tee   +4 more
openaire   +1 more source

Telecommunication customer satisfaction using self‐organized network‐based heuristic algorithm

International Journal of Communication Systems, 2021
Gebrehiwet Gebrekrstos Lema
exaly  

Reconfigurable Add–Drop Optical Filter Based on Arrays of Digital Micromirrors

Journal of Lightwave Technology, 2008
Luis Grave de Peralta, A A Bernussi
exaly  

Robust Defense Scheme Against Selective Drop Attack in Wireless Ad Hoc Networks

IEEE Access, 2019
T Poongodi   +2 more
exaly  

Modeling drop size distributions

Progress in Energy and Combustion Science, 2002
exaly  

Home - About - Disclaimer - Privacy