Results 211 to 220 of about 73,181 (230)
Some of the next articles are maybe not open access.
Drop/impact simulation and test validation of telecommunication products
ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208), 2002Portable communication devices suffer impact-induced failure in usage. The products must pass drop/impact tests before shipment. The drop/impact performance is an important concern in product design. Due to the small size of this kind of electronic products, it is very expensive, time-consuming, and difficult to conduct drop tests to detect the failure
J. Wu, G. Song, C.-P. Yeh, K. Wyatt
openaire +1 more source
Board level drop test and simulation of TFBGA packages for telecommunication applications
53rd Electronic Components and Technology Conference, 2003. Proceedings., 2004Reliabilit!- perfonnance of IC packages during drop impact is critical, especially for handheld electronic products. Currently. thcrc is no detailed test standard in the industry to advise on the procedures for board level dmp test. nor there is any model Ilia1 providcs good correlation with experimental ineasiircinents of acceleration and impact life.
null Tong Yan Tee +4 more
openaire +1 more source
Telecommunication customer satisfaction using self‐organized network‐based heuristic algorithm
International Journal of Communication Systems, 2021Gebrehiwet Gebrekrstos Lema
exaly
The flagship is dropping behind the fleet [UK telecommunication industry]
Electronics & Communication Engineering Journal, 1994openaire +1 more source
Reconfigurable Add–Drop Optical Filter Based on Arrays of Digital Micromirrors
Journal of Lightwave Technology, 2008Luis Grave de Peralta, A A Bernussi
exaly
Robust Defense Scheme Against Selective Drop Attack in Wireless Ad Hoc Networks
IEEE Access, 2019T Poongodi +2 more
exaly
REPORT TO THE NATION: CANCER DEATH RATES DROP, BUT TOTAL NUMBER OF CASES RISE
Ca-A Cancer Journal for Clinicians, 2002exaly
A novel methodology for virtual qualification of IC packages under board level drop test
2008Jing-En Luan, Xavier Baraton
exaly

