Results 171 to 180 of about 94,929 (301)

Affecting the Properties of Copper–Graphene Electroconductive Composite by Severe Plastic Deformation

Advanced Engineering Materials, EarlyView.
Copper‐based composites enhanced with carbon feature convenient mechanical properties and favorable electric conductivity. Processing via deformation and thermomechanical treatments can introduce advantageous microstructures further enhancing their performance. Herein, copper–graphene powder‐based composites are directly consolidated via rotary swaging
Radim Kocich, Lenka Kunčická, Pavel Czernek, Zifan Wang   +3 more
wiley   +1 more source

Droplet Size Distribution of Oil-in-Milk Emulsions: Continuous Emulsification via a Vortex-Based Hydrodynamic Cavitation Device. [PDF]

ACS Omega
Ravi A, Ranade VV.
europepmc   +1 more source

Microstructure‐Controlled Crack Propagation and Fracture Resistance in MoSiBTiC Alloy Revealed by Multiscale Extended Finite Element Method Modeling

Advanced Engineering Materials, EarlyView.
A two‐dimensional multiscale finite element analysis framework was established for the first‐generation MoSiBTiC alloy, and the mechanical and fracture‐related parameters of the constituent phases were calibrated through experiments and simulations. The framework provides a basis for analyzing crack propagation behavior in its complex microstructure ...
Junfeng Du, Takahiro Kaneko, Xinyu Yan, Takahito Ohmura, Kyosuke Yoshimi   +4 more
wiley   +1 more source

Modeling Mist to Annular Flow Development in the Discharge of a Compressor

, 2012
A model has been created to describe the development of flow leaving a compressor as it transitions from mist to annular flow. Flow parameters such as the drop size, drop speed, drop concentration, film thickness, and film velocity change as a function ...
Wujek, Scott S., Hrnjak, Predrag S.
core  

Microstructure Evolution of a VMnFeCoNi High‐Entropy Alloy After Synthesis, Swaging, and Annealing

Advanced Engineering Materials, EarlyView.
The synthesis and processing (rotary swaging and annealing) of the novel VMnFeCoNi alloy is investigated, alongside the estimation of the grain size effect on hardness. Analysis of a wide grain size range of recrystallized microstructures (12–210 µm) reveals a low annealing twin density.
Aditya Srinivasan Tirunilai, Zeki Ayrildi, Buse Şen, Maik Rajkowski, Mathias Redondo Garcia, Markus Stricker, Guillaume Laplanche   +6 more
wiley   +1 more source

A scale-invariant log-normal droplet size distribution below the critical concentration for protein phase separation. [PDF]

Elife
Amico T, Dada ST, Lazzari A, Brezinova M, Trovato A, Vendruscolo M, Fuxreiter M, Maritan A.   +7 more
europepmc   +1 more source

SIMULATION OF DROPLET SIZE DISTRIBUTION DURING JUMPING-DROPLET CONDENSATION

The Proceedings of the International Conference on Nuclear Engineering (ICONE), 2019
Chongyan, Zhao, Feng, Chen, Xiao, Yan, He, Yan, Zhiyong, Huang, Hanliang, Bo   +5 more
openaire   +1 more source

Slip Localization Intensification Mediated by Grain Boundary Sliding in a Polycrystalline Nickel‐Based Superalloy

Advanced Engineering Materials, EarlyView.
The temperature dependence of fatigue behavior in nickel‐based superalloys is investigated through high‐resolution measurements of plastic localization. While increasing temperature reduces localization and enhances fatigue performance in René 88DT, Inconel 718 exhibits a sharp degradation at intermediate temperature due to intensified slip ...
M. Calvat, D. Anjaria, I. Woo, C. Bean, D. Texier, J. C. Stinville   +5 more
wiley   +1 more source

Interpret probability density functions and maximum entropy model for zinc removal in PRDC column by analyzing droplet size distribution. [PDF]

Sci Rep
Asadollahzadeh M, Torkaman R.
europepmc   +1 more source

Tailoring Functional Properties of Ti–Ni–Cu Shape Memory Alloy Thin Films for MEMS Actuators

Advanced Engineering Materials, EarlyView.
A comprehensive study of critical parameters required to develop well‐performing Ti–Ni–Cu thin film shape memory alloy microactuators is provided. Materials science and device integration aspects are integrated by addressing structural and physical relationships using complementary characterization techniques as well as a practical fabrication solution
Elaheh Akbarnejad, Aleksander Kostka, Gowtham Arivanandhan, Yujiao Li, Alan Savan, Manfred Kohl, Alfred Ludwig   +6 more
wiley   +1 more source