Results 61 to 70 of about 32,188 (265)
Toughening β‐Ga2O3 via Mechanically Seeded Dislocations
β‐Ga2O3 is promising for next‐generation semiconductors but its brittleness limits flexible and high‐precision applications. Here, mechanically seeded dislocations introduced by surface deformation improved damage tolerance in (001) β‐Ga2O3. Nanoindentation and characterization show dislocations suppress cleavage cracks by enabling stable plastic ...
Zanlin Cheng +5 more
wiley +1 more source
An innovative medium entropy alloy (MEA) composite material was fabricated via micro laser powder bed fusion (μ‐LPBF) with appropriate nano‐ceramic particles doping and exhibited markedly improved overall performance, including synergistically enhanced strength and ductility, increased hardness and compressive strength, improved wear resistance and ...
Zhonglin Shen, Mingwang Fu
wiley +1 more source
Switchable Supramolecular Adhesive by Tuning Interfacial Bonding and Modulus
The supramolecular adhesive (HyDiP) shows reversible adhesion and recyclability. In the dehydrated state, it is dense, stiff (E ≈445 MPa), transparent, and provides strong bonding with adhesion strengths up to 4.65 MPa. In the hydrated state, it becomes porous, soft (E ≈0.11 MPa), and detaches easily, enabling sustainable high‐strength applications ...
Rumin Fu +10 more
wiley +1 more source
Displacement ductility for seismic design of RC walls for low-rise housing
The paper compares and discusses displacement ductility ratios of reinforced concrete walls typically used in one- and two-story houses. Ductility is investigated by assessing response measured on 39 walls tested under shaking table excitations and quasi-
Julian Carrillo +2 more
doaj +1 more source
Structural Porosity and Low Mineral Density in Enamel Rods Drive Molar Incisor Hypomineralisation
This study uses advanced imaging modalities on multiple length scales to show that molar‐incisor hypomineralization does not present as a locally homogeneous pathology. Instead, microstructural defects, characterized through non‐mineralized, protein‐rich sheaths and an altered mineral structure in between prism rods, resulting in local differences in ...
Katharina Jähn‐Rickert +14 more
wiley +1 more source
The purpose of this work is to test the effectiveness of strengthening timber structures by means of composite bars. This article presents the results of preliminary tests carried out on solid beams made of fir wood.
Justyna Dygas +2 more
doaj +1 more source
Ultrathin AlOxHy interlayers between aluminum films and polymer substrates significantly improve electro‐mechanical properties of flexible thin film systems. By precisely controlling interlayer thickness using atomic layer deposition, this study identifies an optimal interlayer thickness of 5–10 nm that enhances ductility and delays cracking.
Johanna Byloff +9 more
wiley +1 more source
A Cu‐based crystal‐glass composite with high‐density twins is identified by a fast screening technique using combinatorial sputtering together with XRD and nanoindentation mapping. This bamboo‐like structure demonstrates homogenous plastic flow and retains high strength during in situ high temperature tests, up to 1 GPa at 550°C, owing to those ...
Chunhua Tian +10 more
wiley +1 more source
Although the precepts of capacity design and detailing for ductile performance are now well established, the end-user community is now demanding more in terms of predictable performance with an expectation that structures should survive earthquakes with minimal and preferably no damage.
openaire +2 more sources
Conductive Bonding and System Architectures for High‐Performance Flexible Electronics
This review outlines bonding technologies and structural design strategies that support high‐performance flexible and stretchable electronics. Bonding approaches such as surface‐activated bonding and anisotropic conductive films, together with system‐level architectures including buffer layers and island‐bridge structures, possess distinct mechanical ...
Kazuma Nakajima, Kenjiro Fukuda
wiley +1 more source

