Results 191 to 200 of about 88,208 (278)

Large‐Area 2D Metasurface‐Based Triboelectric E‐Skin Arrays: Contact & Proximity Tactile Mapping with Broadband Acoustic Readouts

Advanced Materials, EarlyView.
Metasurface‐engineered NC‐TENG arrays integrate tactile pressure mapping, non‐contact gesture sensing, and acoustic signal readouts in one ultrathin module, and outperforms pristine PDMS in terms of electrical output and real‐time spatial mapping for next‐gen wearables.
Injamamul Arief, Swagato Sarkar, Anik Kumar Ghosh, Osvalds Verners, Kamal Kumar Meena, Su‐Hyeong Lee, Soosang Chae, Tobias A. F. König, Beate Krause, Andreas Fery, Mehmet Sait Özer, Anindya Nag, Amit Das   +12 more
wiley   +1 more source

Mechanistic insight for T-cell exclusion by cancer-associated fibroblasts in human lung cancer. [PDF]

Elife
Ackermann J, Bernard C, Sirven P, Salmon H, Fraldi M, Ben Amar MD.   +5 more
europepmc   +1 more source

Perspective on Aqueous Batteries: Historical Milestones and Modern Revival

Advanced Materials, EarlyView.
This review retraces the development of aqueous batteries from classical Zn‐MnO2 chemistry to modern Zn and Ni systems, correlating voltage, capacity, and electrolyte formulation with practical performance. By mapping historical success and failure onto current and future research directions, it identifies guiding principles that steer the design of ...
Fangwang Ming, Dong Guo, Yizhou Wang, Hussam Qasem, Hanfeng Liang, Husam N. Alshareef   +5 more
wiley   +1 more source

Charge Transfer States in Donor–Acceptor Bulk‐Heterojunctions as Triplet–Triplet Annihilation Sensitizer for Solid‐State Photon Upconversion

Advanced Materials Interfaces, EarlyView.
A near‐infrared photosensitizer that facilitates efficient solid‐state photon upconversion by recycling triplets formed within a fullerene‐based donor–acceptor bulk‐heterojunction system is demonstrated. Spectroscopic investigations reveal that the energy of photogenerated charge transfer states of triplet character (3CT) is subsequently transferred to
Maciej Klein, Alexander R. Ireland, Evan G. Moore, Dennis Delic, Ajay K. Pandey   +4 more
wiley   +1 more source

Hierarchical reinforcement learning with central pattern generator for enabling a quadruped robot simulator to walk on a variety of terrains. [PDF]

Sci Rep
Watanabe T, Kubo A, Tsunoda K, Matsuba T, Akatsuka S, Noda Y, Kioka H, Izawa J, Ishii S, Nakamura Y.   +9 more
europepmc   +1 more source

Direct Ink Writing 3D Printing of Recyclable and Thermally Stable Vitrimers

Advanced Materials Technologies, EarlyView.
Vitrimers hold great promise in additive manufacturing as defect‐insensitive, repairable, and recyclable feedstocks. A thin‐film additively manufactured process is developed for a high‐performance vitrimer that is difficult to process traditionally.
Louis O. Vaught, Ronald Sellers, Andreas A. Polycarpou   +2 more
wiley   +1 more source

Linear and weakly nonlinear stability analyses of Darcy Bénard convection with feedback control. [PDF]

Sci Rep
Siddheshwar PG, Revankar VV, Jagadeesh Kumar MS.   +2 more
europepmc   +1 more source

Laser‐Based Solidification of Cermets/Cemented Carbides: Processing‐Microstructure‐Property Relationships

Advanced Materials Technologies, EarlyView.
Recent research on laser‐processed cermets and cemented carbides highlights significant advancements, yet a notable paucity of studies and persistent challenges remain. Efforts are increasingly focused on developing low‐cost, environmentally friendly cermets as alternatives to conventional materials.
Himanshu Singh Maurya, Farid Akhtar, Konda Gokuldoss Prashanth   +2 more
wiley   +1 more source

Friction-driven scission: How nonlocal mechanisms contribute to membrane fission across domains of life. [PDF]

Sci Adv
Landajuela A, Gomis Perez C, Bassereau P, Callan-Jones A, Karatekin E.   +4 more
europepmc   +1 more source

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

Advanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal, Davey Boss, René H. Poelma, Elias Vlieg, John J. Schermer   +4 more
wiley   +1 more source