Electrified Damage in Motion Systems
The electrified damage in motion systems is a fundamental framework presenting the degradation pathway arising from the coupling of electrical energy transport with mechanical contact and interfacial chemistry. The framework positions electrified damage as a distinct degradation regime with unique characteristic surface morphologies and failures of ...
M. Humaun Kabir +2 more
wiley +1 more source
Thermoacoustic wave propagation in hydrodynamic poroelastic media with temperature-dependent thermal conductivity. [PDF]
Alshehri AM, Lotfy K.
europepmc +1 more source
Design and Analysis of Compression–Torsion Coupling Metamaterials Using the Golden Section Method
A novel compression–torsion metamaterial is engineered using inclined rods and symmetry breaking. To optimize its torsional performance, the golden section method is employed. The mechanical response of the metamaterial is validated through both numerical analysis and experimental validation.
Amirhossein Hassani, Sara Bagherifard
wiley +1 more source
A review on conductive polymeric nanocomposites for advanced electromagnetic interference shielding: materials, mechanisms, and applications. [PDF]
Fallah A +4 more
europepmc +1 more source
Preparation of Expanded Graphite/Paraffin-Based Composite Phase Change Materials (PCMs) via Low-Temperature In Situ Synchronous Expansion. [PDF]
Yang H, Zhang Y, Cui B, Li W, Zhao Q.
europepmc +1 more source
CPCM/OSS Backfill Materials: Enhanced Thermal Properties and Heat Transfer Performance for Ground Heat Exchangers in Ground Source Heat Pump Systems. [PDF]
Zhou D, Zhou F, Yuan J, Liu Y.
europepmc +1 more source
Benzoxazine-based innovations in shielding: enhancing durability and protection in electronics and clothing. [PDF]
Arishi AAM, Alamry KA, Hussein MA.
europepmc +1 more source
Quantum-modified photo-thermoelastic wave propagation in semiconductors with temperature-dependent thermal conductivity. [PDF]
Alshalhoub S +5 more
europepmc +1 more source
An Analytical Modeling Study on the Thermal Behavior of Copper-Carbon Nanotube Composite Through-Silicon Via (TSV). [PDF]
Ying K, Liang J.
europepmc +1 more source

