Results 141 to 150 of about 139,348 (340)
Role of Dislocation Rearrangement in the Elastic Modulus Recovery of Deformed Copper
M. Koiwa, Ryukiti R. Hasiguti
openalex +2 more sources
The elastic moduli of human subchondral, trabecular, and cortical bone tissue and the size-dependency of cortical bone modulus [PDF]
Kwang‐Wook Choi+3 more
openalex +1 more source
Wearable Haptic Feedback Interfaces for Augmenting Human Touch
The wearable haptic feedback interfaces enhance user experience in gaming, social media, biomedical instrumentation, and robotics by generating tactile sensations. This review discusses and categorizes current haptic feedback interfaces into force, thermal, and electrotactile stimulation‐based haptic feedback interfaces, elucidating their current ...
Shubham Patel+3 more
wiley +1 more source
This study presents a novel approach to designing and fabricating high‐porosity 3D‐printed scaffolds using a customized resin. Scaffold geometry, cellular interactions, and mechanical properties are analyzed to demonstrate these engineered bone models.
Sera Choi+6 more
wiley +1 more source
Numerical Modeling of the Dynamic Elastic Modulus of Concrete. [PDF]
Gidrão GMS+5 more
europepmc +1 more source
Hardness and elastic modulus of TiN based on continuous indentation technique and new correlation [PDF]
Donald S. Stone, Karl Yoder, W.D. Sproul
openalex +1 more source
The seed pod valves of Australian Banksia attenuata plants are not simply bi‐layers which bend when dry. These experiments and models reveal complex mechanics, which allow seed release only after several steps of seed pod opening. Stiffness gradients prevent delamination of the valves during loading, and a shape‐memory function protects the seeds ...
Friedrich Reppe+7 more
wiley +1 more source
The electroplating of a CrCoNi medium‐entropy alloy is achieved using a mixture of an ionic liquid and an aqueous solution containing metal salts. The CrCoNi medium‐entropy alloy thin film exhibits high wear and corrosion resistance superior to conventional hard chromium coatings. Abstract High‐entropy alloys (HEAs) and medium‐entropy alloys (MEAs) are
Yuki Murakami+7 more
wiley +1 more source
Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging [PDF]
C.P. Wong, R.S. Bollampally
openalex +1 more source