Results 51 to 60 of about 35,478 (261)

Bias Induced Ambipolar Transport in Organic Heterojunction Sensors

Advanced Electronic Materials
Interface engineering in organic heterostructures is an important approach to tuning the characteristics of organic electronic devices and improving their performances in applications, such as gas sensing.
Abhishek Kumar, Charles H. Devillers, Rita Meunier‐Prest, Dimitri Sabat, Eric Lesniewska, Marcel Bouvet   +5 more
doaj   +1 more source

Development of a Smart Bed Insert for Detection of Incontinence and Occupation in Elder Care

IEEE Access, 2019
In order to adequately care for an increasingly aging population, there is a need for novel technical solutions to enhance the standard of living for patients and elderly people.
Moritz Fischer, Michael Renzler, Thomas Ussmueller   +2 more
doaj   +1 more source

Tailoring Functional Properties of Ti–Ni–Cu Shape Memory Alloy Thin Films for MEMS Actuators

Advanced Engineering Materials, EarlyView.
A comprehensive study of critical parameters required to develop well‐performing Ti–Ni–Cu thin film shape memory alloy microactuators is provided. Materials science and device integration aspects are integrated by addressing structural and physical relationships using complementary characterization techniques as well as a practical fabrication solution
Elaheh Akbarnejad, Aleksander Kostka, Gowtham Arivanandhan, Yujiao Li, Alan Savan, Manfred Kohl, Alfred Ludwig   +6 more
wiley   +1 more source

Creep Properties and Deformation Mechanism of Additively Manufactured NiAl‐CrMo Composites

Advanced Engineering Materials, EarlyView.
Additively manufactured NiAl‐CrMo composites contain numerous interfaces and cell boundaries that control their creep response. At 700°C under high applied stress, creep is dominated by dislocation‐controlled power‐law mechanisms. At 800°C–900°C and lower stresses, creep is primarily diffusion‐controlled along cell boundaries.
Jan Vollhüter, Andreas Bezold, Johan Westraadt, Katharina Fiegl, Subham Chattoraj, Benjamin Wahlmann, Carolin Körner, Michael Mills, Mathias Göken, Steffen Neumeier   +9 more
wiley   +1 more source

Recycling of NiTi Shape Memory Alloys: Fundamental and Technological Aspects of a Vacuum Induction Melting Processing Route

Advanced Engineering Materials, EarlyView.
The present study investigates recycling of NiTi shape memory alloys via vacuum induction melting. An ingot was synthesized from elemental Ni and Ti and subjected to three subsequent remelting cycles. Remelting increases process durations and impurity levels and adversely affects microstructures and functional properties.
Sakia Sophia Noorzayee, Son Tung Mai, Sarath Menon, Braulio Gadiel Sánchez Ortega, Ralf Drautz, Alexander Kauffmann, Gunther Eggeler, Jan Frenzel   +7 more
wiley   +1 more source

Design, Optimisation and Prototyping of Variable Reluctance Resolvers With Narrower Stator Excitation Teeth

IET Electric Power Applications
This paper aims to enhance the performance of the existing non‐overlapping variable reluctance resolvers (VRRs) to obtain more accurate position signals by optimising the stator excitation teeth using genetic algorithm (GA).
Davood Karamalian, Behrooz Majidi, Mohammadreza Moradian, Khoshnam Shojaei, Sayyed Mohammad Mehdi Mirtalaei   +4 more
doaj   +1 more source

Current Status and Challenges in Data Collection for Aerospace Coatings Deposited by Plasma Spraying

Advanced Engineering Materials, EarlyView.
An innovative approach has been integrated into the GRENAT project to optimize plasma spraying and coating performance. Raw materials are accelerated and melted in the plasma generated by torches, creating coatings. Monitoring sensors collect process data which are combined with ex situ characterization data.
Lila Randriamananjara, Vincent Rat, Quentin Dubreuil, Patrice Valorge, Simon Goutier, Alain Denoirjean, Olivier Messe, Céline Ruelle, Jean‐Philippe Poli   +8 more
wiley   +1 more source

Smart protection system for identification and localisation of faults in multi-terminal DC microgrid

IET Smart Grid, 2020
DC microgrid provides the horizontal infrastructures to integrate distributed generation (DG) and loads. Unlike traditional AC systems, DC systems cannot survive or sustain high magnitude fault currents. It makes locating faults very difficult.
Rajeev Kumar Chauhan, Kalpana Chauhan, Kalpana Chauhan   +2 more
doaj   +1 more source

Soft Mechanical‐Electrical Logic Using Liquid Metal‐Filled 3D‐Printed Architectures

Advanced Engineering Materials, EarlyView.
We present 3D‐printed soft mechanical–electrical logic elements that use liquid metal–filled silicone tubes actuated by thermoplastic polyurethane/polylactic acid (TPU/PLA) architectures to produce Boolean operations. Complementary normally open and normally closed unit cells perform repeatable binary transitions and can be combined into more complex ...
Christoph Lehmann, Ryan Kalgreen, Laura M. Comella   +2 more
wiley   +1 more source

Cathodic Cage Plasma Deposition of Nanostructured Cu–Fe–Se Coatings on Poly(methyl Methacrylate)

Advanced Engineering Materials, EarlyView.
Nanostructured Cu–Fe–Se coatings are deposited on PMMA by a modified cathodic cage plasma process, enabling low‐temperature deposition on polymer substrates. A transition from discontinuous to compact morphology is observed with temperature, with optimal properties at 200°C, where improved CuFeSe2‐type bonding, lowest sheet resistance, and favorable ...
V. S. S. Sobrinho, M. Naeem, T. H. C. Costa, M. S. Libório, J. C. A. Queiroz, C. B. B. Luna, R. R. M. Sousa, P. S. Vieira, E. M. Araújo   +8 more
wiley   +1 more source