Results 51 to 60 of about 368,328 (309)

Thermodynamic Pathways of Nonequilibrium Solidification in Wire‐Arc Additive Manufacturing Fe‐Based Multicomponent Alloy Structures

open access: yesAdvanced Engineering Materials, EarlyView.
Geometry‐driven thermal behavior in wire‐arc additive manufacturing (WAAM) influences microstructural evolution during nonequilibrium solidification of a chemically complex Fe–Cr–Nb–W–Mo–C nanocomposite system. By comparing different deposits configurations, distinct entropy–cooling rate correlations, segregation, and carbide evolution are revealed ...
Blanca Palacios   +5 more
wiley   +1 more source

Electrical and Computer Engineering Department Course Descriptions, May 1984 [PDF]

open access: yes, 1984
This document contains course summaries of the Electrical and Computer Engineering Department offered in 1984. Although these descriptions are representative of course content, there may be variations from quarter to quarter or from instructor to ...

core  

Tailored Hierarchical Porous Copper Architectures via Three Dimensional Printing and Pressure‐less Sintering for Next‐Generation Lithium‐Metal Batteries

open access: yesAdvanced Engineering Materials, EarlyView.
A hierarchical porous copper current collector is fabricated via three‐dimensional printing combined with pressureless sintering to stabilize lithium metal anodes. The interconnected architecture lowers local current density, guides uniform Li deposition within pores, and suppresses dendrite growth.
Alok Kumar Mishra, Mukul Shukla
wiley   +1 more source

The Department of Electrical and Computer Engineering Newsletter

open access: yes, 2011
Fall 2011 News and notes for University of Dayton\u27s Department of Electrical and Computer Engineering.https://ecommons.udayton.edu/ece_newsletter/1000/thumbnail ...
University of Dayton. Department of Electrical and Computer Engineering
core  

Retracted: E-Commerce Logistics Intelligent Warehousing System Solution Based on Multimedia Technology

open access: yesJournal of Electrical and Computer Engineering, 2023
Journal of Electrical and Computer Engineering
doaj   +1 more source

Thermomechanical Fatigue and Creep–Fatigue Interaction of Inconel 718 Additively Manufactured by Laser Beam Powder Bed Fusion

open access: yesAdvanced Engineering Materials, EarlyView.
Thermomechanical fatigue tests of laser beam powder bed fusion (PBF‐LB) Inconel 718 show that the additively manufactured material reaches almost the lifetimes of conventionally‐rolled material under no‐dwell conditions. Introducing dwell times at the maximum temperature markedly reduces the lifetimes due to pronounced grain boundary sliding associated
Stefan Guth   +6 more
wiley   +1 more source

Fresnoite examined by circularly polarized Raman scattering.

open access: yes, 1978
Thesis: B.S., Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science, 1978Includes bibliographical references.B.S.B.S.
Chieu, Trieu Can.
core  

Retracted: Construction of Tourism Management Engineering Based on Data Mining Technology

open access: yesJournal of Electrical and Computer Engineering, 2023
Journal of Electrical and Computer Engineering
doaj   +1 more source

Near‐Field Electrospinning Micro‐Printhead Achieves Precise Control of Nanofiber Deposition

open access: yesAdvanced Engineering Materials, EarlyView.
A micro‐printhead for near‐field electrospinning enables reproducible deposition of polymer nanofibers with diameters below 50 nm. Systematic parameter studies uncover the mechanisms linking operating conditions to fiber morphology, paving the way for precise and low‐cost nanoscale 3D manufacturing.As a high‐resolution, cost‐effective, and rapid ...
Han Xu, Dario Mager, Jan G. Korvink
wiley   +1 more source

Retracted: Design and Research of Building Indoor Environment Monitoring System Relying on 3D Modeling and Image Processing

open access: yesJournal of Electrical and Computer Engineering, 2023
Journal of Electrical and Computer Engineering
doaj   +1 more source

Home - About - Disclaimer - Privacy