Results 91 to 100 of about 2,265,679 (371)

Non-Gaussian Resistance Noise near Electrical Breakdown in Granular Materials

open access: yes, 2004
The distribution of resistance fluctuations of conducting thin films with granular structure near electrical breakdown is studied by numerical simulations.
Andersen   +27 more
core   +2 more sources

Deep dielectric charging of regolith within the Moon\u27s permanently shadowed regions [PDF]

open access: yes, 2014
Energetic charged particles, such as galactic cosmic rays (GCRs) and solar energetic particles (SEPs), can penetrate deep within the lunar surface, resulting in deep dielectric charging.
Jordan, Andrew P.   +5 more
core   +2 more sources

Channeling the electrical breakdown of air by optically heated plasma filaments

open access: yes, 2014
Femtosecond laser pulses with sufficiently high peak power leave tracks of dilute plasma in their wakes. Potential use of this plasma for channeling electrical discharges in the atmosphere has been discussed and demonstrated in laboratory-scale ...
M. Scheller   +3 more
semanticscholar   +1 more source

Micromechanical Insights into Sinter‐Based Additively Manufactured NiTi with Nb as a Sintering Aid

open access: yesAdvanced Engineering Materials, EarlyView.
This study investigates the microstructural and micromechanical behavior of NiTiNb made through filament‐based materials extrusion via chemically correlated nanoindentation. B19' remnants from the original powder lead to Nb gradients within NiTiNb grains due to the short sintering times required in liquid‐phase sintering.
Nerea Abando   +4 more
wiley   +1 more source

Microcellular Poly (Ethylene‐Co‐Vinyl Acetate)/Lignin Nanocomposites for Soft Ferroelectrets

open access: yesAdvanced Engineering Materials, EarlyView.
Lignin valorization for advanced porous polymer nanocomposites development and an upscaling route for continuous manufacturing of soft ferroelectrets for energy harvesting are studied. This work examines the role of lignin and carbon nanotubes (CNT) in modifying the mechanical, dielectric, and ferroelectret properties of poly (ethylene‐co‐vinyl acetate)
Yuchen Lian   +5 more
wiley   +1 more source

A Novel Simplified Approach to Physically Simulate Wire‐Arc Directed Energy Deposition Conditions

open access: yesAdvanced Engineering Materials, EarlyView.
Scarcity of specialized titanium alloy wires and high experimental wire production costs impedes wire‐arc directed energy deposition (waDED) adoption in industry. A novel, wireless approach is introduced to accelerate and economize titanium alloy development.
Martin Klein   +4 more
wiley   +1 more source

Some Factors Effecting on the Dielectric Strength for (PVC- Kaolin) Composites [PDF]

open access: yesEngineering and Technology Journal, 2011
This research includes the effect of kaolin additions to the polymer matrix (PVC) and study some factors affecting to dielectric strength. The kaolin powder was added as percentage by weight (1,2,3 and 4%) to PVC, and the specimens formed by hot pressing
doaj   +1 more source

Optimum Electrical and Dielectric Performance of Multi-Walled Carbon Nanotubes Doped Disposed Transformer Oil

open access: yesEnergies, 2020
This paper intends to prepare a nanofluid sample by suspending Multi-walled Carbon Nanotubes (MWCNTs) at 0.005g/L concentration and analyze the behavior of electrical and dielectric properties based on the International Electrotechnical Commision test ...
Nur Sabrina Suhaimi   +6 more
doaj   +1 more source

Highly Stable Low‐Temperature Phosphate Glass as a Platform for Multimaterial 3D Printing of Integrated Functional Microfluidic Devices

open access: yesAdvanced Engineering Materials, EarlyView.
A highly stable, low‐temperature phosphate glass is developed for multimaterial additive manufacturing of multifunctional microfluidics. Glass, metal conductors, and sacrificial polymer are coprinted, enabling monolithic fabrication. The sacrificial paste forms precise channels and decomposes during sintering.
Babak Mazinani   +2 more
wiley   +1 more source

Investigation of ultra-thin Al₂O₃ film as Cu diffusion barrier on low-k (k=2.5) dielectrics [PDF]

open access: yes, 2011
Ultrathin Al(2)O(3) films were deposited by PEALD as Cu diffusion barrier on low-k (k=2.5) material. The thermal stability and electrical properties of the Cu/low k system with Al(2)O(3) layers with different thickness were studied after annealing.
Chen, Fei   +8 more
core   +1 more source

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