Results 71 to 80 of about 2,265,679 (371)
This study demonstrates a novel, additive manufacturing approach to produce complex, porous tungsten carbide structures using water‐based direct ink writing/robocasting. Leveraging a modified commercial printer and heat treatment, the process yields lightweight, electrically conductive 3D architectures capable of supporting a mechanical load.
James Bentley Bevis+3 more
wiley +1 more source
Degradation of polycrystalline HfO2-based gate dielectrics under nanoscale electrical stress [PDF]
The evolution of the electrical properties of HfO2/SiO2/Si dielectric stacks under electrical stress has been investigated using atomic force microscope-based techniques.
A. Bayerl+10 more
core +2 more sources
An organic film-assisted electrical breakdown technique is proposed to selectively remove metallic (m-) single-walled carbon nanotubes (SWNTs) in full length towards creation of pure semiconducting SWNT arrays which are available for the large-scale ...
K. Otsuka+3 more
semanticscholar +1 more source
Direct Consolidation of Copper–Graphene Composite by Rotary Swaging
The applicability of the rotary swaging method for preparation of electroconductive copper–graphene composite by direct consolidation of powders is proven. The consolidated material features advantageous microstructure featuring fine grains and twins, with homogeneous distribution of graphene, primarily along the twin boundaries, which contribute to ...
Radim Kocich+2 more
wiley +1 more source
An electrical lifetime of polymers in terms of the catastrophe theory
The present study analyzes the known expressions establishing exponential and power relationships between the lifetime of polymer dielectrics and the strength of the electric field acting on them.
Kiselevich Valentin
doaj +1 more source
Zener tunneling in conductive graphite/epoxy composites: Dielectric breakdown aspects
The electrical responses of conductive graphite/epoxy composites subjected to an applied electric field were investigated. The results showed that reversible dielectric breakdown can easily occur inside the composites even under low macroscopic field ...
S. C. Tjong, L. X. He
doaj +1 more source
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan+5 more
wiley +1 more source
Experimental Modelling of the Breakdown Voltage of Air Using Design of Experiments
Many experimental and numerical studies were devoted to the electric discharge of air, and some mathematical models were proposed for the critical breakdown voltage.
REZOUGA, M.+3 more
doaj +1 more source
The Kondo breakdown scenario has been claimed to allow the $T$-linear resistivity in the vicinity of the Kondo breakdown quantum critical point, two cornerstones of which are the dynamical exponent $z = 3$ quantum criticality for hybridization ...
Kim, Ki-Seok
core +1 more source
This work reveals the phase composition and quantitative morphology analysis of precipitation‐hardened Fe32Cu12Ni11Ti16Al29 complex‐concentrated alloy. The precipitates are shown to have a high coherency. Morphology transition between sphere, cuboidal, and elongated morphology is observed. Finally, the overaging behavior is captured using microhardness.
Rostyslav Nizinkovskyi+4 more
wiley +1 more source