Results 131 to 140 of about 2,254,616 (328)
In‐mold electronics (IME) undergo complex thermoforming and over‐molding processes that strain device integrity. This study demonstrates how adapting the amount and placement of structural adhesive to local deformation levels preserves electrical functionality.
Francisco Ituriel Arias‐García+3 more
wiley +1 more source
Surface Modification of Fluorine‐Free Superhydrophobic Materials with (Ultra‐)Thin TiO2 Layers
Significant changes in wettability, with a reduction of 60o in the water conduct angle, are reported via the surface modification of fluorine‐free superhydrophobic thin films, prepared by aerosol‐assisted chemical vapor deposition, after coating a 4 nm layer of titanium dioxide on the surface using atomic layer deposition.
Julie Jalila Kalmoni+2 more
wiley +1 more source
Freeze‐drying of layered silicate is the key to get coatings with superior gas barrier. Freeze‐drying of layered silicates modified with dodecylamine (DDA) is a highly effective technique for the preparation of barrier pigments that significantly mitigate the permeation of oxygen, water vapor, and hydrogen through polymer films containing these ...
Joshua Lommes+4 more
wiley +1 more source
Regional, institutional, and departmental factors associated with gender diversity among BS-level chemical and electrical engineering graduates. [PDF]
Jarboe LR.
europepmc +1 more source
Journal of Electrical and Computer Engineering
doaj +1 more source
Programmable Reconfiguration of Hybrid 4D Chiral Metamaterials via Mechanical and Thermal Stimuli
A class of hybrid chiral mechanical metamaterials is designed to achieve programmable reconfiguration through soft networks, hinges, and bilayer joints integrated with rigid units. Responsive to mechanical and thermal stimuli, these structures exhibit large volume changes, tunable deformation pathways, and both positive and negative thermal expansion ...
Yunyao Jiang, Siyao Liu, Yaning Li
wiley +1 more source
Interdisciplinary Approaches towards Materials with Enhanced Properties for Electrical Engineering. [PDF]
Wiesbrock F.
europepmc +1 more source