Results 91 to 100 of about 2,360,838 (375)

Electrical resistivity across the tricriticality in itinerant ferromagnet

open access: yes, 2017
We investigate the discontinuous ferromagnetic phase diagram near tricritical point in UCo 1-x Ru x Al compounds by electrical resistivity measurements.
Opletal, Petr   +3 more
core   +2 more sources

Robocasting of a Water‐Based Biopolymer/WO3 Nanopowder Paste as a Precursor to Tungsten Carbide Lattices

open access: yesAdvanced Engineering Materials, EarlyView.
This study demonstrates a novel, additive manufacturing approach to produce complex, porous tungsten carbide structures using water‐based direct ink writing/robocasting. Leveraging a modified commercial printer and heat treatment, the process yields lightweight, electrically conductive 3D architectures capable of supporting a mechanical load.
James Bentley Bevis   +3 more
wiley   +1 more source

Electrical Resistivity and Thermal Expansion Measurements of URu2Si2 under Pressure

open access: yes, 2008
We carried out simultaneous measurements of electrical resistivity and thermal expansion of the heavy-fermion compound URu2Si2 under pressure using a single crystal.
Amato A.   +18 more
core   +1 more source

Beyond Order: Perspectives on Leveraging Machine Learning for Disordered Materials

open access: yesAdvanced Engineering Materials, EarlyView.
This article explores how machine learning (ML) revolutionizes the study and design of disordered materials by uncovering hidden patterns, predicting properties, and optimizing multiscale structures. It highlights key advancements, including generative models, graph neural networks, and hybrid ML‐physics methods, addressing challenges like data ...
Hamidreza Yazdani Sarvestani   +4 more
wiley   +1 more source

Low‐Activation Compositionally Complex Alloys for Advanced Nuclear Applications—A Review

open access: yesAdvanced Engineering Materials, EarlyView.
Low‐activation compositionally complex alloys (LACCAs) are advanced metallic materials primarily composed of low‐activation elements, offering advantages such as rapid compliance with operational standards and safe recyclability. This review highlights their potential for extreme high‐temperature irradiation environments as structural materials for ...
Yangfan Wang   +8 more
wiley   +1 more source

Ferromagnetic quantum phase transition in Sr$_{1-x}$Ca$_x$RuO$_3$ thin films [PDF]

open access: yes, 2009
The ferromagnetic quantum phase transition in the perovskite ruthenate Sr$_{1-x}$Ca$_x$RuO$_3$ is studied by low-temperature magnetization and electrical resistivity measurements on thin films.
Cao   +8 more
core   +2 more sources

The Electrical Resistance of the Human Body [PDF]

open access: yesThe Journal of Nervous and Mental Disease, 1897
n ...
openaire   +3 more sources

Influence of Temperature on Scratch and Wear Properties of Technical Thermoplastics: Implications for Material Selection

open access: yesAdvanced Engineering Materials, EarlyView.
The share of technical thermoplastics is expected to grow further in the e‐mobility segment. In this study, a detailed temperature‐based tribological characterization of technical thermoplastics is performed. The tribological properties are discussed in terms of the dynamic mechanical properties of polymers at different ambient temperatures. A proof of
Harsha Raghuram   +2 more
wiley   +1 more source

Correspondence between electrical resistivity and total suction in compacted kaolin considering the presence of salt

open access: yesE3S Web of Conferences, 2016
Prospection techniques based on measuring the electrical resistivity of geomaterials are being used mainly for geophysical characterization, for evaluating soil contamination and the extension of contaminated areas, in addition to the compaction control ...
Dias Ana Sofia   +2 more
doaj   +1 more source

Wafer Bonding Technologies for Microelectromechanical Systems and 3D ICs: Advances, Challenges, and Trends

open access: yesAdvanced Engineering Materials, EarlyView.
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan   +5 more
wiley   +1 more source

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