Results 91 to 100 of about 118,914 (341)
Advanced Engineering Materials, EarlyView.High‐temperature interactions between low‐sulfur Al‐killed Mn–B steel and MgO–C refractories (0 and 50 wt% recyclates) are studied via finger immersion tests (1600 °C). Surface‐active elements influence infiltration. MgO/CaS layer forms, along with spinel and calcium silicate.
Matheus Roberto Bellé +5 more
wiley +1 more source
Case Studies in Construction MaterialsThis study investigates the enhancement of copper-functionalized graphene oxide (Cu-GO) on cement composites. Graphene oxide (GO) was synthesized and functionalized with copper ions to improve its electrical conductivity.
Jin Kim +4 more
doaj +1 more source
Surface and Electrical Properties of Electro-Coagulated Thermal Waste
High Temperature Materials and Processes, 2015 The Electro-Coagulated Thermal Waste (ECTW) sample of the impedance spectroscopy investigation for electrical modulus and conductivity are presented. Electrical properties via temperature and frequency dependent impedance spectroscopy were investigated ...
Yesilkaya S. S. +3 more
doaj +1 more source
Transport properties of Layer-Antiferromagnet CuCrS2: A possible thermoelectric material
, 2010 The electrical, thermal conductivity and Seebeck coefficient of the quenched, annealed and slowly cooled phases of the layer compound CuCrS2 have been reported between 15K to 300K.
A. K. Rastogi +15 more
core +1 more source
Screen‐Printed Flexible Piezoelectric Force Sensor Array with Electromagnetic Interference Shielding
Advanced Engineering Materials, EarlyView.This article introduces a flexible screen‐printed piezoelectric sensor array designed for low‐frequency healthcare applications such as tactile sensing and cardiovascular monitoring. The device integrates interface electronics enabling the simultaneous acquisition of up to 128 signals, along with flexible EMI shielding that significantly reduces noise ...
Joseph Faudou +6 more
wiley +1 more source
Investigation of Ag-Cu Alloys for Interconnects in IC [PDF]
EPJ Web of ConferencesCopper (Cu) has been the standard material of choice for interconnects in integrated circuits for decades because it has low resistivity (~1.68 µΩ·cm), high electrical conductivity, and is cost-effective.
S Aditya +4 more
doaj +1 more source
Liquid Level Sensor for High Temperature Molten Salt in Confined Container [PDF]
, 2013 Electrical resistance measurements on different rod materials in liquid solutions, molten salts, or molten lead are considered to design a liquid level sensor in a sealed containers when the temperature of the fluid is very high (~1000ºC) and ...
Allazadeh, Mohammad Reza +2 more
core
Thermal conductivity of single crystalline MgB_2
, 2002 The ab-plane thermal conductivity $\kappa$ of single-crystalline hexagonal MgB_2 has been measured as a function of magnetic field H with orientations both parallel and perpendicular to the c-axis and at temperatures between 0.5 and 300 K.
Jun, J. +4 more
core +1 more source
Inflammatory Response‐Inspired Thermochromic Shield for Pneumatic Structures
Advanced Engineering Materials, EarlyView.A thermochromic shield for pneumatic structures is developed, using anhydrous sodium acetate powder and thermochromic pigment‐included solution. In this shield composed of three layers, the exothermic and thermochromic reactions, followed by the mixture of both components, occur promptly with an incident of penetrating damage as a sign of initial ...
Hyun Jae Lee, Ryuma Niiyama
wiley +1 more source