Results 131 to 140 of about 31,807 (169)

Electro-thermal and quantum analysis of CNT-based interconnections

2017 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization for RF, Microwave, and Terahertz Applications (NEMO), 2017
Due to the rapid increases in current densities, wires, planar conductors and ground lines, become more and more vulnerable to electromigration. Future RF advanced packaging applications require new materials endowed of low electrical resistance, high reliability, chip-to-package interconnects, and improved thermal management.
Mencarelli, Davide, Stocchi, Matteo, Pierantoni, Luca   +2 more
openaire   +1 more source

Analysis of the electro-thermal behaviour of multichip power modules

Conference Record of 1998 IEEE Industry Applications Conference. Thirty-Third IAS Annual Meeting (Cat. No.98CH36242), 2002
This paper presents an approach to the analysis of the electro-thermal behaviour of multichip power modules. A better understanding of thermal interactions among chips mounted inside the same package is important for the optimisation of the module design both in terms of performance and long term reliability.
F. Profumo, A. Tenconi, S. Facelli, B. Passerini   +3 more
openaire   +1 more source

Electro-thermal analysis for automotive high power MOSFETs

2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2017
Power dissipated within a semiconductor package must be properly extracted in order to guarantee safe and reliable operation in an automotive high power application. This work analyzes the transient thermal characteristics of two surface mount MOSFET packages types, TOLL and PQFN 5×6 for various heat sinking configurations.
Asantha Kempitiya, Wibawa Chou
openaire   +1 more source

Electro-thermal loss analysis of the 3L-ANPC converter

2014 IEEE 5th International Symposium on Power Electronics for Distributed Generation Systems (PEDG), 2014
The three-level active-neutral-point-clamped (3L-ANPC) voltage source converter (VSC) is used to overcome the uneven loss distribution. In 3L-ANPC VSC the dissipation in the power device is typically characterized by Sinusoidal Pulse Width Modulation (SPWM).
null Long Cheng, null Quan Chen, null Guoli Li, null Cungang Hu, null Changbao Zheng, null Guanghui Fang   +5 more
openaire   +1 more source

Electro-thermal coupled analysis of MOSFET under IEMI

2018 International Applied Computational Electromagnetics Society Symposium - China (ACES), 2018
Analysis of MOSFET under intentionally electromagnetic interferences (IEMIs) has been taken by using the self-developed electro-thermal software since this external interferences have been blamed for unexplained breakdowns and burnouts of many vulnerable electronic circuits and systems.
Yong Li, Haiyan Xie, Jianguo Wang
openaire   +1 more source

Electro-thermal analysis of IGBT module from 3D CAD model

2019 International Conference on IC Design and Technology (ICICDT), 2019
An integrated simulation environment for multi-physics simulation of IGBT modules was developed. A coupled electro-thermal analysis is described in this paper. Starting from a detailed 3D CAD model of the module and the schematic of an application circuit utilizing the module, both in industry-standard file formats, the simulation environment extracts ...
Hui Wang, Ding Gong, Chen Shen
openaire   +1 more source

Electro-thermal analysis of CFETs with a dual-substrate architecture

Semiconductor Science and Technology
Abstract In complementary FET (CFET) architectures, the vertically stacked device configuration inherently limits heat dissipation paths, leading to severe self-heating effects (SHE), particularly in the upper device.
Seung Kyu Kim, Kee-Won Kwon
openaire   +1 more source

Electro-thermal modeling and analysis of bidirectional quasi Z-source inverter

IECON 2016 - 42nd Annual Conference of the IEEE Industrial Electronics Society, 2016
This paper is about an electro-thermal model to estimate the semiconductors junction temperature of bidirectional quasi Z-source inverter. Firstly, three types of averaged loss models are presented and compared. In the presented model the impact of the output current waveforms on the loss calculation is considered.
Shoudao Huang, Peng Fan, Derong Luo, Ping Liu 0010, Huimin Li   +4 more
openaire   +1 more source

Statistical electro-thermal analysis with high compatibility of leakage power models

23rd IEEE International SOC Conference, 2010
In this work, a statistical electro-thermal analyzer with high compatibility of power model is developed. The developed analyzer takes both the easily implementing advantage of Monte Carlo method and the fast convergent advantage of stochastic analysis method to effectively solve the statistical electro-thermal problem.
Huai-Chung Chang, Pei-Yu Huang, Ting-Jung Li, Yu-Min Lee   +3 more
openaire   +1 more source

An arnoldi based thermal network reduction method for electro-thermal analysis

IEEE Transactions on Components and Packaging Technologies, 2003
In this paper we consider the problem of approximating the large discretized thermal network that models the heat conduction phenomenon in an electrical system by means of models of reduced state-space dimensions. To this aim we present an efficient and numerically stable Arnoldi type algorithm by which a multi-point moment matching approximant of the ...
CODECASA, LORENZO, D'AMORE, DARIO, MAFFEZZONI, PAOLO   +2 more
openaire   +2 more sources