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A new diode model formulation for electro-thermal analysis
ISCAS'99. Proceedings of the 1999 IEEE International Symposium on Circuits and Systems VLSI (Cat. No.99CH36349), 2003Thermal effects due to the self heating of semiconductor devices is efficiently included in electrical simulators adding an equivalent RC network that models the thermal phenomenon. In this paper we consider the numerical problems that arise in the electro-thermal simulation of circuits containing strongly heating diodes.
Dario D'Amore, Paolo Maffezzoni
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Thermal networks for electro-thermal analysis of power devices
Microelectronics Journal, 2001This work presents a derivation of the equivalent thermal network associated to the distributed heat diffusion process which takes place in an electrical circuit. Precise definition of temperature and dissipated power density for the elementary electrical element are presented.
CODECASA, LORENZO +2 more
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Pyro-Electro-Thermal Analysis of LiNbO3 using Microheaters
2015 Fotonica AEIT Italian Conference on Photonics Technologies, 2015Microheaters have been widely investigated for their sensor-based applications, such as gas sensor, flow rate sensor and other microsystems. Here, we investigate the pyroelectric effect, activate by microheaters fabricated on -Z surface of LiNbO3 crystal.
Bhowmick, S. +7 more
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Analysis of electro-thermal instability in bipolar transistors
2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC), 2015This paper illustrates an analytical method to determine the electro-thermal instability due to self-heating and impact ionization in terms of dissipated power and junction temperature. The analysis is carried out for single transistors (corresponding to silicon and gallium arsenide technologies) as well as for scaled devices to appreciate the use of ...
Suresh Balanethiram, Anjan Chakravorty
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Size-Dependent Electro-Thermal Buckling Analysis of Flexoelectric Microbeams
International Journal of Structural Stability and Dynamics, 2023This paper studies electro-thermal buckling in a flexoelectric microbeam. This first-of-a-kind study focuses on two case-specific types of buckling in microbeams, which are essential to microstructures. Because of the electric fields and high temperatures in their environments, microbeams are susceptible to electro-thermal buckling more often than ...
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Electro-Thermal Analysis of Suspended Multiwalled Carbon Nanotubes
2020 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), 2020This paper studies the electro-thermal property of suspended multiwalled carbon nanotubes (MWCNTs) with high-bias voltages. A compact model of resistance with temperature-dependent parameters is employed for electric modeling of MWCNTs. In the thermal analysis, a compact model of thermal conductivity is considered and the finite difference method is ...
Longfei Li, Peidong Li, Min Tang
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Electro-thermal and mechanical analysis of a MEMS switch
International Conference on Electrical & Computer Engineering (ICECE 2010), 2010Micro electro mechanical systems (MEMS) have experienced an explosive growth over the past few years driven mainly by its physical properties and its promising technological applications in many different fields, particularly in space and Radio Frequency (RF) systems. MEMS technology exhibits greater advantages over the existing semiconductor switches.
Md. Asaduzzaman +2 more
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A review of the use of electro-thermal simulations for the analysis of heterostructure FETs
Microelectronics Reliability, 2007Abstract This paper deals with using device-level numerical simulations for the investigation of the electro-thermal behavior of a GaAs-based heterostructure FET. We show a way of dealing with the software/hardware limitations related with the huge disproportion between the electrically active region and the volume relevant to heat outflow.
SOZZI, Giovanna, MENOZZI, Roberto
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Comprehensive electro-thermal(ET) analysis with considering ET coupling
2011 9th IEEE International Conference on ASIC, 2011Temperature and supply voltage directly influence IC performance and reliability. Thus electro-thermal(ET) analysis including power/ground(P/G) analysis and thermal analysis is very important in IC design. But present ET analysis is simply implemented because P/G analysis doesn't consider temperature changes and thermal analysis always assume supply ...
Huang Kun +3 more
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Electro-thermal analysis of Electric Double-Layer-Capacitors
2008 14th International Workshop on Thermal Inveatigation of ICs and Systems, 2008Electric double layer capacitors (EDLCs) operate between rechargeable batteries and electrolytic capacitors with respect to energy and power performance. Prediction of internal heating due to discharge and charge current cycles is one of key elements for producing reliable and safe devices with long cycle-life.
Ph. Guillemet, C. Pascot, Y. Scudeller
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