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Electro-Thermal Analysis of 3D Power Delivery Networks

open access: yes, 2012
Reliable design of power delivery networks for three-dimensional integrated circuits face several challenges due to electro-thermal coupling, TSV substrate coupling, long parasitic current paths, frequent and large current demands. Since these challenges are triggered by excessive voltage droop and high temperatures, the need for dedicated methods to ...
Todri-Sanial, Aida   +4 more
openaire   +1 more source

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