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Supported Nanoparticle Synthesis by Electrochemical Deposition
2015textcopyright Springer International Publishing Switzerland 2016. All rights reserved.This Handbook covers all aspects of Nanoparticles, from their preparation to their practical application. The chapters present different ways to synthesize nanometer particles, as well as their functionalization and other surface treatments to allow them to a ...
Ustarroz Troyano, Jon +2 more
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Vibrational Spectroscopy of Electrochemically Deposited Hydrogen on Platinum
Physical Review Letters, 1994Absolute vibrational spectra of the electrochemical H/Pt and H/Pt(100) interfaces in the under- and overpotential ranges are measured by ir-vis sum frequency generation. The vibrational signature of the underpotential-deposited hydrogen is structure sensitive and is related to its bonding configuration and to the water molecules located in the double ...
Peremans, André +1 more
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Electrochemical Liquid Deposition of Ceria
Journal of the American Ceramic Society, 1994Electrochemical liquid deposition (ELD) has been used to grow fully dense films of ceria on impervious gadolinia‐doped ceria substrates of variable thickness. The process is similar to electrochemical vapor deposition (EVD) except that a liquid is used instead of a vapor to provide precursor material to the growing film.
Cameron W. Tanner, Anil V. Virkar
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Electrochemical deposition of Al on semiconductors
SPIE Proceedings, 2002Samples used for the fabrication of M-S diodes were growing by Chochralski method especially undoped n-type GaP into (III) oriented wafers. The thickness and carrier concentration was 200-250 mimic and (2-4). 10 exp17 atom/cm3 respectively. At first ohmical contact to the one side of wafer was formed by alloying of indium at the temperature 600°C ...
Tinatin Laperashvili +2 more
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Electrochemically Deposited Diffusion Barriers
Journal of The Electrochemical Society, 1994Diffusion barrier properties of electrochemically deposited Ni, Co, and Ni‐Co alloys were examined in the binary system and the Au/Ni/Cu ternary system. Ni and Co were electrodeposited from sulfate or sulfamate (Ni) solutions in the presence of boric acid, at pH 3.30.
Milan Paunovic +3 more
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Electrochemical Deposition of 3D Interconnects
ECS Meeting Abstracts, 20203D integration is an emerging semiconductor technology that is used to form highly integrated small-factor electronic systems by vertically stacking two or more thin electronic chips in a single package. In metallization of 3D through-substrate vias (TSuV) such as through-silicon (TSV), through-glass (TGV), through-ceramic (TCV) interconnects et al,
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