Results 181 to 190 of about 993,713 (397)

Preface for Special Mini-Issue on “Trend of Technology and Materials on EMC (Electromagnetic Compatibility) for Ubiquitous”

, 2003
杉本 諭
openalex   +2 more sources

Solution‐Processable Polymer Nanocomposites for Electromagnetic Interference Shielding

Advanced Materials Interfaces, EarlyView.
This review introduces scalable strategies for fabricating solution‐processable polymer nanocomposites with improved electromagnetic interference (EMI) shielding performance. It compares three fabrication methods, including solution blending, in situ polymerization, and Pickering emulsion polymerization, and highlights their respective advantages in ...
Tuan Sang Tran, Lulu Xu, Per B. Zetterlund, Vipul Agarwal   +3 more
wiley   +1 more source

Giant Spin Pumping at Polymer/Ferromagnet Interfaces for Hybrid Spintronic Devices

Advanced Materials Interfaces, EarlyView.
The integration of spintronic materials into flexible electronics takes a leap forward with efficient spin pumping across metal‐polymer interfaces. Despite large resistivity mismatch, a silicon‐based polymer (HSQ) demonstrates high spin mixing conductance (≈20 nm−2), possibly driven by spin‐orbital coupling, unveiling new opportunities for polymer ...
Shiva Gaur, Akash Kumar, Himanshu Bangar, Utkarsh Shashank, Hukum Singh, Saroj Prasad Dash, Anubhav Raghav, Johan Åkerman   +7 more
wiley   +1 more source

Multi‐Material Gradient Printing Using Meniscus‐enabled Projection Stereolithography (MAPS)

Advanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
MAPS is a new vat‐free printing technique that utilizes programmed delivery of resin droplets with custom formulations to enable multi‐material gradient printing of 3D structures with user‐defined variations in mechanical stiffness, opacity, surface energy, cell densities, and magnetic properties. Abstract Light‐based additive manufacturing methods are
Puskal Kunwar, Arun Poudel, Ujjwal Aryal, Rui Xie, Zachary J. Geffert, Haven Wittmann, Daniel Fougnier, Tsung Hsing Chiang, Mathew M. Maye, Zhen Li, Pranav Soman   +10 more
wiley   +1 more source

Modern Wireless Telecommunication Technologies and Their Electromagnetic Compatibility with Life-Supporting Equipment

, 2005
Mats Wallin, Therese Marve, Peter K. Hakansson   +2 more
openalex   +1 more source

Low‐Noise, Unbiased Ferromagnetic‐Resonance‐Driven Thin‐Film Integrated Giant Magnetoimpedance Sensors

Advanced Materials Technologies, EarlyView.
Utilizing a novel (Ni81Fe19/Ti)4/Cu/(Ni81Fe19/Ti)4 thin‐film multilayer with low coercive field, low damping and a superior GMI ratio, a compact, low‐noise unbiased FMR‐driven integrated GMI sensor with a superior magnetic noise performance of ≈100 pT/√Hz is first demonstrated, owing to reduced phase noise from well‐defined aligned magnetic domains and
Bin Luo, Xianfeng Liang, Huaihao Chen, Cai Müller, Paul Raschdorf, Phillip Durdaut, Michael Höft, Jeffrey McCord, Nian‐Xiang Sun   +8 more
wiley   +1 more source

Research on an Electromagnetic Compatibility Test Method for Connected Automotive Communication Antennas. [PDF]

Sensors (Basel)
Ye M, Wang W, Jia J, Cai W, Cao Q, Sheng K.   +5 more
europepmc   +1 more source

Advanced Optical Integration Processes for Photonic‐Integrated Circuit Packaging

Advanced Materials Technologies, EarlyView.
Photonic integrated chip packaging is a growing technology that helps make devices faster, more efficient, and more compact by using light instead of electricity. This review highlights recent progress in making these chips work better at different levels, discusses current challenges like heat and alignment, and looks at future possibilities for ...
Keuntae Baek, Minhyeok Kim, Hak‐Sung Kim, Jinho Ahn, Hongyun So   +4 more
wiley   +1 more source

Laser-Induced Silver Nanowires/Polymer Composites for Flexible Electronics and Electromagnetic Compatibility Application. [PDF]

Polymers (Basel)
Bril' I, Voronin A, Fadeev Y, Pavlikov A, Govorun I, Podshivalov I, Parshin B, Makeev M, Mikhalev P, Afanasova K, Simunin M, Khartov S.   +11 more
europepmc   +1 more source

Electromagnetic compatibility design and its application [PDF]

, 2013
Liang Ying-hua, Liuji R. Koga, Osamu Fujiwara, Bob Scully   +3 more
openalex   +1 more source