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Instantaneous monitoring the early age properties of cementitious materials using PZT-based electromechanical impedance (EMI) technique

Construction and Building Materials, 2019
Abstract The use of piezoelectric materials based Electromechanical Impedance (EMI) technique for monitoring the hydration of cementitious materials has caught much attention recently. However, very few literatures have explored the feasibility of using this method on monitoring the stiffness development and compressive strength gain at the very ...
Yen-Fang Su   +4 more
openaire   +3 more sources

Monitoring of soil water content using spherical smart aggregates based on electromechanical impedance (EMI) technique

Smart Materials and Structures, 2023
Abstract Real-time monitoring of soil water content is of great significance to prevent many engineering accidents, such as landslide, water seepage of foundation dam, and reduction of foundation bearing capacity. Electromechanical impedance (EMI) technique based smart aggregates (SAs) have showed excellent monitoring capability in ...
Chengming Lan   +4 more
openaire   +1 more source

Detection of Damage in Fiber Reinforced Concrete using Piezoceramic Transducers and Electromechanical Impedance (EMI) Method

2021 3rd International Symposium on Signal Processing Systems (SSPS), 2021
The Structural Health Monitoring (SHM) of concrete structures, including fiber concrete structures, receives increasing attention, and the Electromechanical Impedance (EMI)-based method is commonly used. The aim of using fiber reinforced concrete is to maintain the distress in small cracks regarding their width and range.
Maria C. Naoum   +3 more
openaire   +1 more source

Analytical modeling of PWAS in-plane and out-of-plane electromechanical impedance spectroscopy (EMIS)

SPIE Proceedings, 2013
This paper discusses theoretical analysis of electro-mechanical impedance spectroscopy (EMIS) of piezoelectric wafer active sensor (PWAS). Both free and constrained PWAS EMIS models are developed for in-plane (lengthwise) and outof plane (thickness wise) mode.
Tuncay Kamas, Bin Lin, Victor Giurgiutiu
openaire   +1 more source

Understanding the effects of adhesive layer on the electromechanical impedance (EMI) of bonded piezoelectric wafer transducer

Smart Materials and Structures, 2014
This paper investigates the effects of the adhesive layer on the admittance of bonded piezoelectric wafer active sensors (PWASs) through mode identification, parametric studies, and experimental verification. Based on the time-frequency analysis of the broadband ultrasound pitch-catch signal, we discovered that the resonances of the PWAS actuator ...
M M Islam, H Huang
openaire   +1 more source

A time-frequency analysis of the correlation between the electromechanical impedance (EMI) of surface bonded piezoelectric wafer active transducers (PWaTs) and the pitch-catch signal

Ultrasonics, 2021
Ultrasound based Structural Health Monitoring (SHM) commonly uses surface-bonded piezoelectric wafer active transducers (PWaTs) for ultrasound wave generation and sensing. Both the electromechanical impedance (EMI) of the surface bonded PWaT and the ultrasound pitch-catch signal have been studied extensively for damage detection.
openaire   +2 more sources

Monitoring of crack repair in concrete using spherical smart aggregates based on electromechanical impedance (EMI) technique

Smart Materials and Structures
Abstract Cracks will inevitably occur in concrete structures or members during the construction process and service life due to aging, environmental factors, external loads, etc. To improve the strength and stability of the cracked concrete structures, many methods have been proposed to repair the cracks.
Chengming Lan   +5 more
openaire   +1 more source

Monitoring of 3-D Printing Defects Using the Electromechanical Impedance (EMI) Technique

IEEE Transactions on Instrumentation and Measurement
Cristiano Soares Junior   +3 more
openaire   +1 more source

Multi-Modal Temperature Sensing using Electro-Mechanical Impedance (EMI) for Structural Health Monitoring

IEEE Sensors Journal, 2023
Mads Kofod Dahl   +2 more
exaly  

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