Results 141 to 150 of about 5,007,528 (396)

The application of the scanning electron microscope to studies of current multiplication, avalanche breakdown and thermal runaway. Part 1 - General physical basis [PDF]

Scanning electron microscope applications in study of current multiplication, avalanche breakdown, and thermal runaway - Physical ...
Shaw, D. A., Sulway, D. V., Thornton, P. R.   +2 more
core   +1 more source

New electron microscope employs new video display technique [PDF]

, 1967
Video display system for a scanning electron microscope provides slow scanning rates, a self-generated color gradient technique, and allows leisurely viewing of several hours.
Brookshier, W. K., Gilroy, J.
core   +1 more source

Removing Oxide Layers and Retaining Oxide‐Free Steel Surfaces by Polishing in Oxygen‐Free Atmosphere

Advanced Engineering Materials, EarlyView.
In this study, the efficacy of wet mechanical polishing under an oxygen‐free atmosphere for deoxidation and the retention of an oxide‐free steel surface are elucidated using X‐ray photoelectron spectroscopy. The methodology proved successful; however, the results were highly dependent on the preparation of the solvents used to clean the samples after ...
Friedrich Bürger, Lienhard Wegewitz, Wolfgang Maus‐Friedrichs   +2 more
wiley   +1 more source

Characterization of a Miniature Electron Energy Analyzer for Scanning Electron Microscopes [PDF]

, 2017
Ashish Suri, Andrew Pratt, S. P. Tear, C.G.H. Walker, M.M. El-Gomati   +4 more
openalex   +1 more source

Using the scanning electron microscope on the production line to assure quality semiconductors [PDF]

The use of the scanning electron microscope to detect metallization defects introduced during batch processing of semiconductor devices is discussed.
Adolphsen, J. W., Anstead, R. J.
core   +1 more source

Influence of an Oxygen‐Free Atmosphere on Diamond‐Single‐Grain Scratching of Ti–6Al–4V

Advanced Engineering Materials, EarlyView.
Single‐grain scratching of Ti–6Al–4V is investigated under controlled, oxygen‐free, and ambient atmospheres using a novel experimental setup with in situ high‐speed imaging. The approach enables direct observation of chip formation and adhesion under suppressed oxidation.
Berend Denkena, Benjamin Bergmann, Michael Zenger   +2 more
wiley   +1 more source

Population of Nonmetallic Inclusions in Liquid High‐Silicon Electrical Steel in Contact With MgO–C Refractories Based on Recyclates and Environmentally Friendly Binders

Advanced Engineering Materials, EarlyView.
The formation of nonmetallic inclusions (NMIs) was investigated in this study, carrying out immersion tests for 30 min at a temperature of 1600°C with liquid high‐silicon electrical steel (Si ≈ 3 mass‐%) and different MgO–C refractories. Conventional MgO–C refractories were considered, as well as MgO–C refractories containing MgO–C recyclate and ...
Lukas Neubert, Matheus Roberto Bellé, Florian Kerber, Dinesh Kumar Gunasekar, Hans‐Jörn Weddige, Christos G. Aneziris, Olena Volkova   +6 more
wiley   +1 more source

Modeling graphene oxide decorated with FeO, SO and NO

Scientific Reports
In this computational investigation, the effect of decoration of graphene oxide (GrO) with three different species FeO, SO, and NO modulates its electronic structure and reactivity for potential electrode and sensing applications.
Hesham El Meligy, Khaled S. Amin, Hanan Elhaes, Medhat A. Ibrahim   +3 more
doaj   +1 more source

Assessing Altered Coating Adhesion on Plasma‐Deoxidized Surfaces Under Oxygen‐Free Conditions

Advanced Engineering Materials, EarlyView.
This study demonstrates the effectiveness of atmospheric pressure plasma pretreatment in modifying silicon and stainless steel surfaces to improve adhesion. Argon‐hydrogen plasma increases surface roughness and improves adhesion strength, whereas pure argon results in smoother surfaces and structural changes.
Selina Raumel, Lara Kuhr, Khemais Barienti, Sebastian Herbst, Florian Nürnberger, Hans Jürgen Maier, Marc C. Wurz   +6 more
wiley   +1 more source

Investigation of Oxygen‐Free Wetting Behavior of Aluminum on Copper via Molecular Dynamics Simulations and Experiments

Advanced Engineering Materials, EarlyView.
The wettability of aluminum droplets (Al) on different copper substrates (Cu), where liquid Al spreads on solid Cu surfaces to form a liquid–solid interface, is studied numerically and experimentally. The experimental and numerical results show good agreement in the fast‐spreading regime.
Shan Lyu, Timon Steinhoff, Finn‐Lennard Janthur, Sarah Seffer, Jörg Hermsdorf, Christian Klose, Ludger Overmeyer, Hans‐Jürgen Maier, Nina Merkert   +8 more
wiley   +1 more source