Results 241 to 250 of about 5,981,715 (415)

Effect of Acrylic Structural Adhesive as a Joint Reinforcement on Film Deformation during the Thermoforming Process for In‐Mold Electronic Devices

open access: yesAdvanced Engineering Materials, EarlyView.
In‐mold electronics (IME) enables the integration of circuits into more complex scenarios, yet the key challenge remains ensuring a fully functional device. This study investigates how the presence of structural adhesives can improve the performance and functionality of IME devices, addressing key challenges in device integration.
Francisco Ituriel Arias‐García   +3 more
wiley   +1 more source

Predictors of computer anxiety: A cross-sectional study on university students in Bangladesh. [PDF]

open access: yesHeliyon
Jahan N   +10 more
europepmc   +1 more source

An Examination of Aerosol Jet‐Printed Surface Roughness and its Impact on the Performance of High‐Frequency Electronics

open access: yesAdvanced Engineering Materials, EarlyView.
This study explores aerosol jet‐printed (AJP) surface roughness, its effects on the performance of microwave electronics, and its process contributors. First, an electromagnetic model is vetted for AJP's unique roughness signature. Simulations are built which show process‐induced roughness is as significant as conductor resistivity in driving microwave
Christopher Areias, Alkim Akyurtlu
wiley   +1 more source

Influence of an Al‐Doped ZnO Interface Layer on the Thermochromic Properties of VO2 Thin Films Deposited by RF Magnetron Sputtering

open access: yesAdvanced Engineering Materials, EarlyView.
Herein the metal‐to‐insulator transition is investigated when depositing vanadium dioxide (VO2) on glass or aluminum‐doped zinc oxide (AZO). O2 flow tuning during the deposition and additional post annealing are effective to control the metal‐to‐insulator transition. However, the VO2/AZO/glass stack reveals an increase in the transition temperature and
Eduard Llorens Balada   +3 more
wiley   +1 more source

Investigation of Solid‐Solution Phase Formation in AlCuNiSi Medium Entropy Alloys and its Effect on Microstructural, Thermal, and Microhardness Properties

open access: yesAdvanced Engineering Materials, EarlyView.
This study focuses on synthesizing equiatomic AlCuNiSi medium‐entropy alloys using mechanical alloying for advanced industrial applications. Continuous milling leads to grain refinement and the formation of stable BCC/FCC solid‐solution phases, resulting in enhanced mechanical properties. A unique Si‐rich solid‐solution phase is observed, which did not
Mustafa Okumuş   +2 more
wiley   +1 more source

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