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Preface of the 3rd International Electronic Conference on Processes (ECP 2024)
The 3rd International Electronic Conference on Processes—Green and Sustainable Process Engineering and Process Systems Engineering (ECP 2024) was hosted online from 29 to 31 May 2024 [...]
Giancarlo Cravotto
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The role of various alloying elements in face‐centered cubic aluminum on the barrier of a Shockley partial dislocation during its motion is presented. The study aims to understand how alloying atoms such as Mg, Si, and Zr affect the energy landscape for dislocation motion, thus influencing the solid solution hardening and softening in aluminum, which ...
Inna Plyushchay+3 more
wiley +1 more source
Severel Problems of High Polymer for the Electronic and Electrical Engineering Materials
Yujiro SAKURAUCHI
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A multimaterial approach is introduced to improve upon auxetic structures by combining two different polymers into the same reentrant honeycomb structure via additive manufacturing. The deformation behavior as well as the resulting Poisson's ratio are thereby improved significantly.
Alexander Engel+2 more
wiley +1 more source
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan+5 more
wiley +1 more source
Publisher's Note: Engineering of electronic structure of boron-nitride nanotubes by covalent functionalization [Phys. Rev. B74, 153413 (2006)] [PDF]
Chunyi Zhi+3 more
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This study investigates the influence of ceramic fillers—aluminum oxide, boron nitride, and a combination of aluminum oxide and zinc oxide—with different particle sizes, on the thermal conductivity of solid silicone rubber. Additionally, the impact of potential synergistic interactions from the simultaneous addition of selected fillers is explored to ...
Aryan Oktaee+3 more
wiley +1 more source
Analysis of Automation Technology in Electronic Information Engineering
Ting Chen
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