Results 211 to 220 of about 2,098,485 (366)

Enhancing E-Nose Performance via Metal-Oxide Based MEMS Sensor Arrays Optimization and Feature Alignment for Drug Classification. [PDF]

Sensors (Basel)
Kong R, Shen W, Gao Y, Lv D, Ai L, Song W, Tan R.   +6 more
europepmc   +1 more source

The Creative Experiment at the 3rd Grade in the Department of Electrical and Electronic Engineering of Hakodate National College of Technology

, 2008
Yuji Mishima, Yoshihiro Ishii, Yutaka Yamamura, Akira Hasegawa, Takashi Morita, Nobuaki Matsuhashi   +5 more
openalex   +2 more sources

Engineering bands of extended electronic states in a class of topologically disordered and quasiperiodic lattices [PDF]

, 2014
Biplab Pal, Arunava Chakrabarti
openalex   +1 more source

Enhanced Mechanical Properties of Injectable Chitosan–Guar Gum Hydrogel Reinforced with Bacterial Cellulose Nanofibers for Tissue Engineering Applications

Advanced Engineering Materials, EarlyView.
This study presents the development and characterization of injectable nanocomposite hydrogels based on N‐succinyl chitosan, oxidized guar gum, and bacterial cellulose nanofibers. Emphasizing enhanced mechanical properties and biocompatibility, the hydrogels exhibit fast gelation, improved structural integrity, and reduced swelling. Their potential for
Raimundo Nonato Fernandes Moreira Filho, Pascale Chevallier, Silvia Rodriguez Fernandez, Maud Viallon, Matheus Xavier de Oliveira, Ana Lorena de Brito Soares, Diego Mantovani, Judith Pessoa de Andrade Feitosa, Rodrigo Silveira Vieira   +8 more
wiley   +1 more source

Synthetic Band Structure Engineering of Graphene Using Block Copolymer-Templated Dielectric Superlattices. [PDF]

ACS Nano
Jamalzadeh M, Zhang Z, Huang Z, Manzo-Perez M, Kisslinger K, Taniguchi T, Watanabe K, Moon P, Doerk GS, Shahrjerdi D.   +9 more
europepmc   +1 more source

Non-Destructive Inspection System for Bump Joints in Area-Arrayed Flip Chip Packaging Structures(<Special Issue>Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)

, 2009
Yuki Sato, Hideo Miura
openalex   +2 more sources

Improving Learning in Electronic Engineering through Platform Open Source [PDF]

, 2014
Ángela Díez Díez, Ricardo Gago, Carlos Sánchez Fernández, Miguel Ferrero, Ramón Ángel Fernández Díaz   +4 more
openalex   +1 more source

Recent Progress on 2D‐Material‐Based Smart Textiles: Materials, Methods, and Multifunctionality

Advanced Engineering Materials, EarlyView.
Advancements in 2D‐material‐integrated smart textiles are reviewed, with a focus on materials, fabrication methods, and multifunctional applications, including energy harvesting, monitoring, EMI shielding, energy storage, and thermal management. The discussion addresses key challenges and provides insights into the future development of next‐generation
Yong Choi, Jiheon Kim, Jaemin Lee, Xinqi Chen, Byungseok Seo, Wonjoon Choi   +5 more
wiley   +1 more source

Author Correction: On the longevity and inherent hermeticity of silicon-ICs: evaluation of bare-die and PDMS-coated ICs after accelerated aging and implantation studies. [PDF]

Nat Commun
Nanbakhsh K, Shah Idil A, Lamont C, Dücső C, Akgun ÖC, Horváth D, Tóth K, Meszéna D, Ulbert I, Mazza F, Constandinou TG, Serdijn W, Vanhoestenberghe A, Donaldson N, Giagka V.   +14 more
europepmc   +1 more source

Energy-efficient electronics with an air-friction-driven rotating gate transistor using tribotronics

iScience
Summary: Concern for the environment is one of the main factors that are increasing the demand for compact and energy-efficient electronic devices. Recent research has made advances in reducing the power consumption of field-effect transistors, including
Hyunji Shin, Dae Yu Kim
doaj