Results 141 to 150 of about 16,813,404 (391)

Real-Space Adaptive-Coordinate Electronic Structure Calculations

open access: yes, 1995
We present a real-space adaptive-coordinate method, which combines the advantages of the finite-difference approach with the accuracy and flexibility of the adaptive coordinate method.
Galli, Giulia, Gygi, Francois
core   +1 more source

Graphene–Catechol Dental Sealant: Antibacterial and Mechanical Evaluation

open access: yesAdvanced Engineering Materials, EarlyView.
This study presents dental sealants made with graphene and L‐DOPA‐modified graphene. L‐DOPA enhances graphene dispersion, improving sealant properties. The material shows antibacterial activity against S. mutans and L. casei, along with high strength and elasticity.
Renata Pereira   +6 more
wiley   +1 more source

Electronic Structures of Atoms [PDF]

open access: yesThe Journal of Physical Chemistry, 1922
n ...
openaire   +2 more sources

First‐Principles Modeling of Solid Solution Softening and Hardening Effects in Al–Mg–Zr–Si Aluminum Alloys

open access: yesAdvanced Engineering Materials, EarlyView.
The role of various alloying elements in face‐centered cubic aluminum on the barrier of a Shockley partial dislocation during its motion is presented. The study aims to understand how alloying atoms such as Mg, Si, and Zr affect the energy landscape for dislocation motion, thus influencing the solid solution hardening and softening in aluminum, which ...
Inna Plyushchay   +3 more
wiley   +1 more source

Multimaterial Approach to Improve the Mechanical Properties of a Novel Modified Auxetic Reentrant Honeycomb Structure

open access: yesAdvanced Engineering Materials, EarlyView.
A multimaterial approach is introduced to improve upon auxetic structures by combining two different polymers into the same reentrant honeycomb structure via additive manufacturing. The deformation behavior as well as the resulting Poisson's ratio are thereby improved significantly.
Alexander Engel   +2 more
wiley   +1 more source

Wafer Bonding Technologies for Microelectromechanical Systems and 3D ICs: Advances, Challenges, and Trends

open access: yesAdvanced Engineering Materials, EarlyView.
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan   +5 more
wiley   +1 more source

Non-Invasive Optoacoustic Imaging for In-Depth Cultural Heritage Diagnostics

open access: yesPhotonics
The complex composition of cultural heritage (CH) items presents significant challenges in assessing their condition and predicting potential risks of material degradation.
George J. Tserevelakis   +4 more
doaj   +1 more source

Novel Worst-Case Surface Accuracy Evaluation Method and Its Application in Reflector Antenna Structure Design

open access: yesIEEE Access, 2019
In order to ensure the electrical performance of the reflector antenna, the surface accuracy constraint need to be satisfied during the structure design.
Shufei Feng   +4 more
doaj   +1 more source

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