Results 191 to 200 of about 515,492 (292)
CT‐based finite element simulations combined with in situ X‐ray computed tomography are used to analyze insert pull‐out in nickel‐coated polymer foams. Despite variations in material parameters, deformation consistently concentrates within a narrow annular region around the insert.
Yannik Bautz +4 more
wiley +1 more source
Transient distortions of the South Atlantic Anomaly radiation environments driven by electric fields. [PDF]
Yin ZF +9 more
europepmc +1 more source
Fabrication Routes for Ionic Conducting Fiber Strain Sensors
Ionic conducting fiber strain sensors (ICFSs) offer compliant, textile‐integrable sensing. Thus far, the commercialization of ICFSs has been constrained by fiber fabrication routes. This review provides a fabrication‐centric analysis of ICFSs correlating processing strategies with material properties and scalability.
Leo John Kershaw +3 more
wiley +1 more source
Dynamic Thermal Relaxation in Metallic Films. [PDF]
Wang L +3 more
europepmc +1 more source
This study examines Invar composites reinforced with titanium carbide (TiC) and titanium nitride (TiN) using laser powder bed fusion (LPBF). It presents the influence of reinforcements on microstructure, tensile properties, and thermal expansion. Results show that TiC effectively strengthens Invar while maintaining low thermal expansion, whereas TiN ...
Ayodeji Nathaniel Oyedeji +3 more
wiley +1 more source
An ab initio foundation model of wavefunctions that accurately describes chemical bond breaking. [PDF]
Foster A +9 more
europepmc +1 more source
Rapidly Solidified High‐Strength Invar 36 Prepared by Planar‐Flow Melt Spinning
The Invar 36 alloy was rapidly solidified using the planar‐flow melt‐spinning technique. Ribbon samples with thicknesses ranging from 20 to 160 mm were produced. As the grain size of the ribbon decreased to sub‐micron levels, the hardness increased by more than 2 times.
Bekir Akgül, Mehmet Kul
wiley +1 more source
Phonon-Dominated In-Plane Thermal Conductivity of Single-Flake Metallic Ti3C2Tx MXene. [PDF]
van Hemert MC +9 more
europepmc +1 more source
Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová +6 more
wiley +1 more source

