Results 151 to 160 of about 48,949 (249)

Study of the failure mechanism of the Cu/epoxy interface after modifications by means of surface chemical reactions [PDF]

, 2006
Siau, Sam, Vervaet, Alfons
core   +1 more source

Cobalt Electroplating [PDF]

Scientific American, 1876
openaire   +1 more source

Double-Sided Fabrication of Low-Leakage-Current Through-Silicon Vias (TSVs) with High-Step-Coverage Liner/Barrier Layers. [PDF]

Micromachines (Basel)
Yang B, Sun H, Zhu K, Wang X.
europepmc   +1 more source

MXene-PVA composite for arsenic removal from industrial wastewater: a combined DFT and experimental study. [PDF]

RSC Adv
Hoa VT.
europepmc   +1 more source

Flow Reactor for Sustainable Electrosynthesis Fabricated via Cost-Effective Electroplating and Adhesive Bonding. [PDF]

ChemSusChem
Song CH, Jeong H, Cha YL, Park CP.
europepmc   +1 more source

A contamination-free and low-leakage-current Cu-TSV technology enabled by engineered double-sided processing. [PDF]

Microsyst Nanoeng
Hao Y, Ding Y, Zhang Z, Yang B, Zhang J, Xie H, Chen Z.   +6 more
europepmc   +1 more source

A universal approach for thin high-entropy oxides regulated by Ga₂O₃ layers for oxygen evolution reaction. [PDF]

Nat Commun
Zhang W, Jin H, Guo Y, Cui Y, Qin J, Zhang J, Yamauchi Y, Sugahara Y.   +7 more
europepmc   +1 more source

Preparation of Carbon Fiber Electrodes Modified with Silver Nanoparticles by Electroplating Method. [PDF]

Materials (Basel)
Wang Y, Li R, Hou T, Piao Z, Lv Y, Liu C, Xin Y.   +6 more
europepmc   +1 more source

Electroplating Carbon Nano-Onion on Copper for Dendrite-Free and Anode-Free Zinc-Ion Batteries. [PDF]

Adv Sci (Weinh)
Zhang Y, Banavath R, Upama S, Deshpande S, Cao H, Stepp BR, Attarzadeh N, Peat S, Kosmoski JV, Johnson EC, Green MJ.   +10 more
europepmc   +1 more source

A Useful Approximation to Add up Contributions in Ray Based EM Propagation Algorithms [PDF]

, 2007
Allegretti, Marco, Coppo, L., Perona, Giovanni Emilio   +2 more
core