Results 71 to 80 of about 48,949 (249)

Chronic Disease Monitoring Using Advanced Compliant Materials for Bioelectronics

open access: yesAdvanced Electronic Materials, EarlyView.
Compliant bioelectronic systems enable continuous monitoring of chronic disease through soft, stretchable materials and tissue‐conformal designs that support stable electrophysiological, mechanical, and biochemical sensing. Integration of diverse sensing modalities with thoughtful material selection, device architectures, and advanced fabrication ...
Han Kim   +7 more
wiley   +1 more source

A brief review of copper recovery from electroplating sludge

open access: yesDiscover Sustainability
Electroplating sludge is a hazardous waste generated during the chemical treatment of electroplating wastewater and poses a serious threat to the environment due to its high content of heavy metals and toxic organic matter.
Yan Pan, Xiaoyun Wu, Yaoxing Liu
doaj   +1 more source

Electroplated Functional Materials with 3D Nanostructures Defined by Advanced Optical Lithography and Their Emerging Applications

open access: yesApplied Sciences, 2020
Electroplating has been favored to date as a surface treatment technology in various industries in the development of semiconductors, automobiles, ships, and steel due to its advantages of being a simple, solution-based process, with low cost and high ...
Jinseong Ahn   +3 more
doaj   +1 more source

Fabrication of Switches on Polymer-Based by Hot Embossing [PDF]

open access: yes, 2006
In MEMS technology, most of the devices are fabricated on glass or silicon substrate. However, this research presents a novel manufacture method that is derived from conventional hot embossing technology to fabricate the electrostatic switches on polymer
Chien, Chao-Heng, Yu, Hui-Min
core   +1 more source

Selective Electrolysis of Water Under Artificial Seawater Conditions Using Transition Metal Borate Anodes

open access: yesAdvanced Energy Materials, EarlyView.
The borate‐based cobalt‐iron catalyst promotes selective oxidation of water rather than chlorine evolution reaction during electrolysis of seawater. When integrated into a zero‐gap electrolyzer prototype, this catalyst supports robust splitting of artificial seawater into oxygen and hydrogen on an extended timescale.
Ananta R. Fareza   +10 more
wiley   +1 more source

Engineering Trace‐Amount Electrolyte Additives for Aqueous Zinc Batteries

open access: yesAdvanced Energy Materials, EarlyView.
Large‐amount additives primarily modify the bulk electrolyte by coordinating with Zn2+ or reshaping the hydrogen‐bond network, thereby altering the overall solution chemistry. In contrast, trace‐amount additives mainly operate at the electrode–electrolyte interface, regulating Zn deposition through electric double‐layer modulation, interfacial ...
Zhaoxin Li   +9 more
wiley   +1 more source

Aerospace Manufacturing Industry: A Simulation-Based Decision Support Framework for the Scheduling of Complex Hoist Lines [PDF]

open access: yes, 2017
The hoist scheduling problem is a critical issue in the design and control of Automated Manufacturing Systems. To deal with the major complexities appearing in such problem, this work introduces an advanced simulation model to represent the short-term ...
Basán, Natalia Paola   +3 more
core   +2 more sources

Automated Alignment Powered by Computer Vision Streamlines the Two‐Photon Polymerization‐Based Micro 3D Printing of Multiscale and Multimaterial Structures

open access: yesAdvanced Intelligent Discovery, EarlyView.
Two‐photon polymerization enables high‐resolution microfabrication, but performing alignment when printing multiple structures is difficult. Here, we present a fast, robust, and open‐source protocol for automated alignment on Nanoscribe systems. Achieving ≈0.4 μm accuracy in under 5 s, our protocol reduces time and error in multimaterial printing. This
Daniel Maher   +4 more
wiley   +1 more source

Leads integral with the internal interconnection that penetrate the molded wall of a package [PDF]

open access: yes, 1969
Multiplicity of external ribbon leads makes possible connections to a sealed or encapsulated microassembly. The leads are integral with the internal connections on a single part that can be fabricated economically by fine-detail ...
Marley, J.
core   +1 more source

Laser-assisted bumping for flip chip assembly

open access: yes, 2001
Published ...
Holmes, AS, Wang, CH
core   +1 more source

Home - About - Disclaimer - Privacy