Results 261 to 270 of about 821,456 (332)
This study examines the surface characteristics of AlInP (001), crucial for advanced solar cells and photoelectrochemical devices. Using theoretical modeling and experiments, it identifies how phosphorus‐rich and indium‐rich surfaces create mid‐gap states that pin the Fermi level and influence ultrafast electron dynamics.
Mohammad Amin Zare Pour+11 more
wiley +1 more source
Quantitative evaluation of China's public health emergencies response policies: a PMC index model approach. [PDF]
Liu Y, Jiao M, Wang Y, Ma A.
europepmc +1 more source
A simulation technique for assessing both the fabrication and operation of a solid‐state Si battery is demonstrated by integrating particle dynamics with mass/charge transport. Although, the fabrication pressure (Pfab) increased the inter‐particle contacts and reduced the concentration (ηconc) and Li‐ion (ηLi+) overpotentials during discharging, it ...
Magnus So+4 more
wiley +1 more source
Self‐organized Criticality in Neuromorphic Nanowire Networks With Tunable and Local Dynamics
Memristive nanowire networks (NWNs) are shown to be electrically tunable to a critical state where specific local dynamics evaluated by multiterminal characterization are exploited as feature selection in nonlinear transformation (NLT) tasks.
Fabio Michieletti+3 more
wiley +1 more source
First aid self-efficacy: a scale adaptation and psychometric properties. [PDF]
Sihvo M, Heilala V, Kärkkäinen T.
europepmc +1 more source
Preparation for an Emergency Major Operation in a Native House
G. Brownlow North
openalex +1 more source
Vascular emergencies in the emergency department
openaire +3 more sources
Emerging substances—emerging problems? [PDF]
openaire +3 more sources
Carbon Nanotube 3D Integrated Circuits: From Design to Applications
As Moore's law approaches its physical limits, carbon nanotube (CNT) 3D integrated circuits (ICs) emerge as a promising alternative due to the miniaturization, high mobility, and low power consumption. CNT 3D ICs in optoelectronics, memory, and monolithic ICs are reviewed while addressing challenges in fabrication, design, and integration.
Han‐Yang Liu+3 more
wiley +1 more source