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High Proton Conductivity Achieved by Encapsulation of Imidazole Molecules into Proton-Conducting MOF-808.

ACS Applied Materials and Interfaces, 2019
Metal-organic frameworks (MOFs), as newly emerging materials, show compelling intrinsic structural features, e.g., the highly crystalline nature and designable and tunable porosity, as well as tailorable functionality, rendering them suitable for proton ...
Hong‐Bin Luo   +5 more
semanticscholar   +1 more source

A 3D-Honeycomb Network with Unique Encapsulation of Dimers of 1D-Chains

Crystal Growth & Design, 2004
Arylmonosulfonates upon treatment with 4,4‘-bipyridine resulted in the formation of a 3D-honeycomb network containing continuous channels, which are occupied by the π stacking dimers of 1D-chains of 4,4‘-bipyridine-H, and a bilayer architecture.
Kumar Biradha and, Goutam Mahata
openaire   +2 more sources

TCP Acknowledgement Encapsulation in Coded Multi-Hop Wireless Networks

2014 IEEE 79th Vehicular Technology Conference (VTC Spring), 2014
This work proposes a solution to overcome the inherent degradation of TCP performance in multi- hop wireless networks. Based on a Network Coding entity integrated between the TCP and the IP layer, we propose a mechanism to encapsulate TCP acknowledgments, which are transmitted along with other segments, thus reducing the number of frames to be sent. We
David Ros   +3 more
openaire   +1 more source

Defect-Free Encapsulation of Fe0 in 2D Fused Organic Networks as a Durable Oxygen Reduction Electrocatalyst.

Journal of the American Chemical Society, 2018
Because they provide lower cost but comparable activity to precious platinum (Pt)-based catalysts, nonprecious iron (Fe)-based materials, such as Fe/Fe3C and Fe-N-C, have gained considerable attention as electrocatalysts for the oxygen reduction reaction
Seok-Jin Kim   +9 more
semanticscholar   +1 more source

Semipermanent Copper Nanowire Network with an Oxidation‐Proof Encapsulation Layer

Advanced Materials Technologies, 2019
AbstractCopper nanowires (Cu NWs) have gained attention as an alternative to noble metal nanowires due to their affordable price, but their susceptibility to rapid oxidization in ambient conditions has remained a critical limitation for their practical usage. Many studies have been conducted to address this disadvantage but have been successful only in
Insic Hong   +13 more
openaire   +2 more sources

VHDL modeling for encapsulating of DNP3 protocol in IEEE 802.15.4 Network

2014 IEEE PES Transmission & Distribution Conference and Exposition - Latin America (PES T&D-LA), 2014
This paper describes the VHDL modeling of Smart Meters communication based on DNP3 protocol point-to-point Network using IEEE 802.15.4 interface. The modeling was validated with the simulation of three scenarios which show that the measured latency is in line with the requirements of Smart Grid Applications. So, these results indicate that the approach
V. E. do Nascimento   +4 more
openaire   +2 more sources

Encapsulation security protocol design for local area networks

1989
Construction of a simple local area network encapsulation security protocol is discussed. The paper illustrates the way that the key distribution scheme, the confidentiality algorithm, and the integrity algorithm drive the protocol construction. A Needham/Schroeder based key distribution scheme, DES Cipher Block Chaining, and the Message Authentication
openaire   +2 more sources

Diallyl Phthalate/Epoxy Interpenetrating Polymer Network Encapsulating Materials

Journal of Elastomers & Plastics, 1981
This paper describes diallyl phthalate/epoxy interpenetrating encapsulating resins as a replacement for the moisture sensitive epoxies now used in light emitting diode (LED) displays. These encapsulation re sins will find application in the electronics industry in potting the small LEDs used in display devices for watches, calculators, and computers.
openaire   +2 more sources

Time-versus size-based CPRI in ethernet encapsulation for next generation reconfigurable fronthaul

IEEE\/OSA Journal of Optical Communications and Networking, 2017
L. Valcarenghi, K. Kondepu, P. Castoldi
semanticscholar   +1 more source

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