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Entropy Production-Based Full-Chip Fatigue Analysis: From Theory to Mobile Applications

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2019
Through-silicon vias (TSVs) are subject to thermal fatigue due to stress over time, no matter how small the stress is. Existing works on TSV fatigue all rely on measurement-based parameters to estimate the lifetime, and cannot consider detailed thermal profiles.
Tianchen Wang   +3 more
openaire   +1 more source

NEW NUCLEATION THEORIES AND PRINCIPLE OF MINIMUM ENTROPY PRODUCTION

Proceeding of Physical Chemistry of Aqueous Systems: Meeting the Needs of Industry, 2023
Frantisek Marsik, Pavel Sopuch, J. Blaha
openaire   +1 more source

Irreversible entropy production: From classical to quantum

Reviews of Modern Physics, 2021
Gabriel T Landi
exaly  

High-entropy ceramics: Review of principles, production and applications

Materials Science and Engineering Reports, 2021
Masayoshi Fuji, Kaveh Edalati
exaly  

Run-and-tumble motion: field theory and entropy production

Journal of Statistical Mechanics - Theory and Experiment, 2021
openaire   +1 more source

Theory of Free Energy and Entropy in Noncovalent Binding

Chemical Reviews, 2009
Huan-Xiang Zhou, Michael K Gilson
exaly  

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