Results 111 to 120 of about 37,835 (161)

Sulfur-containing compound in epoxy molding compound

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy, 2014
With the rapid development of the semiconductor filed, more and more challenges have been put forward to the packaging materials as well. Epoxy molding compound (EMC) as one the most important packaging material with the monopoly position was required for low water absorption, high adhesion, and low internal stress and so on. Here, adhesion improvement
Xingming Cheng, Hongjie Liu, Wei Tan, Chi Qiu, Lanxia Li, Jianglong Han   +5 more
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Polymerization compounding: Epoxy‐montmorillonite nanocomposites

Polymer Engineering & Science, 2002
AbstractA strategy to design intercalated montmorillonite nanocomposites has been explored. A commercial organoclay, 1.34 TCN (Nanocor Inc.), with bis(2‐hydroxylethy1) methy1 tallow ammonium, was modified by tolylene 2,4‐diisocyanate (TDI) and bisphenol A (BA).
Wei Feng, Abdellatif Ait‐kadi, Bernard Riedl   +2 more
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Self‐curing epoxy compounds

Journal of Applied Polymer Science, 1990
AbstractA new series including eight structurally different self‐curing epoxy compounds bearing azomethine linkages were synthesized, characterized and polymerized. 4‐(2,3‐Epoxypropoxy)‐benzaldehyde (EPB) or 2,3‐epoxypropyl glyoxylate monohydrate (EPG), prepared by reacting 4‐hydroxybenzaldehyde or glyoxylic acid monohydrate, respectively, with excess ...
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Epoxy molding compound for fingerprint sensor

2016 International Conference on Electronics Packaging (ICEP), 2016
The fingerprint sensor is promising as a personal identification method for the devices. For downsizing and the cost reduction of the fingerprint sensor, capacitance method is main stream for the portable devices such as Smartphone's. Conventionally, expensive sapphire glass has been used as insulating layer of fingerprint sensor, but sapphire glass is
Junichi Tabei, Hideaki Sasajima, Takeshi Mori   +2 more
openaire   +1 more source

Epoxy Compounds for Immobilizing Radioactive Wastes

Atomic Energy, 2005
The radiation resistance of epoxy compounds, solidified by crystalline hardening agents - metaphenyl-enediamine and phthalic anhydride - is investigated. It is shown that under conditions of γ irradiation (E = 1.33 MeV) the temperature of vitrification of the compounds depends on the dose (doses up to 1500 Mrad were investigated) and temperature 20–160°
Ya. I. Shtrombakh, P. A. Platonov, N. S. Lobanov, O. K. Chugunov, V. P. Aleksandrov, O. A. Zinov’ev   +5 more
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Ablation resistance of certain epoxy compounds

Polymer Mechanics, 1972
The rate of ablation in oxidative and inert media at flow velocities up to 200 m/sec has been investigated for certain epoxy compounds containing powdered copper and zinc dust. The causes of ablative destruction and the factors tending to improve the ablation resistance are examined.
A. N. Machyulis, L. P. Zhilinskaite
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Thermophysical analysis of plasticized epoxy compounds

Journal of Engineering Physics, 1973
A study has been made concerning the effect of dibutylphthalate and thiocol plasticizers in various concentrations on the structure as well as the thermophysical and the mechanical properties of grade ED-5 epoxy resin. It is shown that the entire complex of analyzed thermophysical properties changes appreciably, depending on the kind and on the ...
Yu. N. Krasnobokii, V. P. Dushchenko
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Some experiences with epoxy resin grouting compounds

American Industrial Hygiene Association Journal, 1980
Epoxy resin systems are used in tiling and grouting in the construction industry. Because of the nature of the application, skin contact is the primary hazard. The most prevalent reaction was reddening of the forearms, followed by whole body reddening and loss of appetite, these latter two being associated with smoking while applying the resin.
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Adhesive Compound, Epoxy Room Temperature Curing

2017
<div class="section abstract"> <div class="htmlview paragraph">This specification covers a two-component compound, an epoxy resin base and a hardener, in the form of a paste.</div></div>
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Silane oligomer in epoxy molding compound

2018 China Semiconductor Technology International Conference (CSTIC), 2018
With the rapid development of semiconductor packages, the reliability requirement of the epoxy molding compound as the packaging material becomes more and more rigorous. Introducing adhesion prompter is one of the key methods to increase the reliability of epoxy molding compound, and silane coupling agent with different functional group was one of the ...
Hongjie Liu, Zhen Wang, Wei Tan, Lanxia Li, Xingming Cheng, Xiaojuan Jiang, Liang Cui   +6 more
openaire   +1 more source