Results 191 to 200 of about 117,724 (349)
Effect of pyrogallol compounds dosage on mechanical properties of epoxy coating [PDF]
Wei Tao Huang +7 more
openalex +1 more source
Studies of Thermal Stability of Epoxy Compounds for Glass-Fiber Pipes [PDF]
Oleg Karandashov, Viacheslav Avramenko
openalex +1 more source
Intrinsically disordered protein‐inspired nanovectors (IDP‐NVs) form stable nanocoacervates (NCs) with diverse biomacromolecules. In situ conformational changes confer stability and adaptability to NCs under dynamically changing physiological conditions.
Soyeong Jin +14 more
wiley +1 more source
Thermal stability and flame retardancy of cellulose nanocrystals reinforced epoxy nanocomposites. [PDF]
Albarqi H +3 more
europepmc +1 more source
Metal‐free carbon catalysts enable the sustainable synthesis of hydrogen peroxide via two‐electron oxygen reduction; however, active site complexity continues to hinder reliable interpretation. This review critiques correlation‐based approaches and highlights the importance of orthogonal experimental designs, standardized catalyst passports ...
Dayu Zhu +3 more
wiley +1 more source
Assessment of the Effect of Phosphorus in the Structure of Epoxy Resin Synthesized from Natural Phenol-Eugenol on Thermal Resistance. [PDF]
Matykiewicz D, Dudziec B, Piasecki A.
europepmc +1 more source
The mechanical properties of epoxy resin composites modified by compound modification [PDF]
Cuiyu Li +3 more
openalex +1 more source
Sub‐atomic scale separation of hydrogen isotopes (H+/D+) require near pristine h‐BN membranes, and scalable synthesis of such high‐quality h‐BN comparable to mechanically exfoliated crystals remains a significant challenge. This study reports a scalable Fe‐catalyzed Machine‐Learning Enabled Chemical vapor deposition process for bottom‐up large‐area ...
Pavan Chaturvedi +8 more
wiley +1 more source
Migration of Bisphenol A and Its Derivatives From Epoxy Coatings and Demand for BPA-NI Products: Scientific Insights and Perspectives Leading to Regulation (EU) 2024/3190. [PDF]
Kajiyama T +4 more
europepmc +1 more source
Trend of Epoxy Molding Compound for Advanced Semiconductor Package
M. Nakamura
openalex +2 more sources

