Results 211 to 220 of about 3,231,981 (274)
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Polymer Chemistry, 2019
To achieve high-Tg and low-dissipation epoxy thermosets, bis(2-methoxy-4-(oxiran-2-ylmethyl)phenyl)isophthalate (2) and tris(2-methoxy-4-(oxiran-2-ylmethyl)phenyl)benzene-1,3,5-tricarboxylate (3) were prepared.
C. Chen+4 more
semanticscholar +1 more source
To achieve high-Tg and low-dissipation epoxy thermosets, bis(2-methoxy-4-(oxiran-2-ylmethyl)phenyl)isophthalate (2) and tris(2-methoxy-4-(oxiran-2-ylmethyl)phenyl)benzene-1,3,5-tricarboxylate (3) were prepared.
C. Chen+4 more
semanticscholar +1 more source
, 2020
Epoxy derived from heteroaromatic compounds and its properties are seldom reported. In this work, two model epoxy monomers (EP-B and EP-F) were synthesized from isophthalic acid and 2,5-furandicarboxylic acid. After curing with 4,4-diaminodiphenylmethane
Yuan Liu+5 more
semanticscholar +1 more source
Epoxy derived from heteroaromatic compounds and its properties are seldom reported. In this work, two model epoxy monomers (EP-B and EP-F) were synthesized from isophthalic acid and 2,5-furandicarboxylic acid. After curing with 4,4-diaminodiphenylmethane
Yuan Liu+5 more
semanticscholar +1 more source
On the curing kinetics of epoxy/PLA compounds
Journal of Materials Research, 2021Non-isothermal curing kinetics of DGEBA/PLA/MTHPA compounds was modeled using Ozawa, Kissinger, Friedman autocatalytic, Friedman and Malek models, whose parameters and associate deviation are reported. Ozawa and Kissinger consider global Ea over the whole conversion, estimated as 65.0 kJ/mol with R2 0.8393 and 87.60; these low R2 are due to the several
Ingridy Dayane dos Santos Silva+4 more
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Reinforcement of epoxy compounds with fillers
Polymer Mechanics, 1972The mechanical and physicochemical properties of epoxy compounds containing different amounts of a series of fillers have been investigated. The strength characteristics of compounds with reinforcing fillers improve, starting from very low concentrations, pass through a maximum, and then fall at large concentrations.
Yu. G. Tarasenko+2 more
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Reactions of Epoxy-compounds by a Radical Mechanism [PDF]
Data on various methods for the initiation of radical reactions of epoxy-compounds, including their homopolymerisation, are reviewed systematically. The bibliography comprises 134 references.
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Journal of Applied Polymer Science, 1990
AbstractA new series including eight structurally different self‐curing epoxy compounds bearing azomethine linkages were synthesized, characterized and polymerized. 4‐(2,3‐Epoxypropoxy)‐benzaldehyde (EPB) or 2,3‐epoxypropyl glyoxylate monohydrate (EPG), prepared by reacting 4‐hydroxybenzaldehyde or glyoxylic acid monohydrate, respectively, with excess ...
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AbstractA new series including eight structurally different self‐curing epoxy compounds bearing azomethine linkages were synthesized, characterized and polymerized. 4‐(2,3‐Epoxypropoxy)‐benzaldehyde (EPB) or 2,3‐epoxypropyl glyoxylate monohydrate (EPG), prepared by reacting 4‐hydroxybenzaldehyde or glyoxylic acid monohydrate, respectively, with excess ...
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, 2014
A novel method to prepare semi-interpenetrating polymer network rigid cross-linked poly(vinyl chloride) (c-PVC) foams with improved shear toughness in the absence of anhydride components is reported.
Zhiwei Jiang+5 more
semanticscholar +1 more source
A novel method to prepare semi-interpenetrating polymer network rigid cross-linked poly(vinyl chloride) (c-PVC) foams with improved shear toughness in the absence of anhydride components is reported.
Zhiwei Jiang+5 more
semanticscholar +1 more source
Thermophysical analysis of plasticized epoxy compounds
Journal of Engineering Physics, 1973A study has been made concerning the effect of dibutylphthalate and thiocol plasticizers in various concentrations on the structure as well as the thermophysical and the mechanical properties of grade ED-5 epoxy resin. It is shown that the entire complex of analyzed thermophysical properties changes appreciably, depending on the kind and on the ...
Yu. N. Krasnobokii, V. P. Dushchenko
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Volume Resistance of Epoxy Molding Compound
2020 China Semiconductor Technology International Conference (CSTIC), 2020Epoxy molding compound, with excellent electrical insulation and mechanical properties as well as low water absorption, has been widely used in insulation application of generators, motors, transformers, LED drivers and other electrical apparatus. With the power increase of the semiconductor device, the rigid requirement of electrical behavior of ...
Duan Yangyang+8 more
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Ablation resistance of certain epoxy compounds
Polymer Mechanics, 1972The rate of ablation in oxidative and inert media at flow velocities up to 200 m/sec has been investigated for certain epoxy compounds containing powdered copper and zinc dust. The causes of ablative destruction and the factors tending to improve the ablation resistance are examined.
L. P. Zhilinskaite, A. N. Machyulis
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