Results 321 to 330 of about 129,206 (361)

Studies on epoxy compound fixation

Journal of Biomedical Materials Research, 1996
Bioprostheses derived from collagenous tissues have to be fixed and subsequently sterilized before they can be implanted in humans. Clinically, the most commonly used fixative is glutaraldehyde. However, the tendency for glutaraldehyde to markedly alter tissue stiffness and promote tissue calcification are well-recognized drawbacks of this fixative. To
Hung-Liang Hsu, Hsing-Wen Sung, Shen-An Liu, Wen-Huey Cheng, Ing-Sh Chiu   +4 more
openaire   +3 more sources

Sulfur-containing compound in epoxy molding compound

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy, 2014
With the rapid development of the semiconductor filed, more and more challenges have been put forward to the packaging materials as well. Epoxy molding compound (EMC) as one the most important packaging material with the monopoly position was required for low water absorption, high adhesion, and low internal stress and so on. Here, adhesion improvement
Lanxia Li, Hongjie Liu, Han Jianglong, Xingming Cheng, Wei Tan, Chi Qiu   +5 more
openaire   +2 more sources

Occupational Asthma From Epoxy Compounds

The Journal of Allergy and Clinical Immunology: In Practice, 2019
Two-component epoxy resin systems (ERSs) composed of epoxy resin and polyamine hardeners are extensively used in industrial and construction coating. Triglycidyl isocyanurate (TGIC) is another type of epoxy derivative, mostly encountered in polyester powder paints.
Katri Suuronen, Emilia Merimaa, Hille Suojalehto, Joaquín Sastre, Irmeli Lindström   +4 more
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Epoxy molding compound for fingerprint sensor [PDF]

2016 International Conference on Electronics Packaging (ICEP), 2016
The fingerprint sensor is promising as a personal identification method for the devices. For downsizing and the cost reduction of the fingerprint sensor, capacitance method is main stream for the portable devices such as Smartphone's. Conventionally, expensive sapphire glass has been used as insulating layer of fingerprint sensor, but sapphire glass is
Hideaki Sasajima, Junichi Tabei, Takeshi Mori   +2 more
openaire   +1 more source

On the curing kinetics of epoxy/PLA compounds

Journal of Materials Research, 2021
Non-isothermal curing kinetics of DGEBA/PLA/MTHPA compounds was modeled using Ozawa, Kissinger, Friedman autocatalytic, Friedman and Malek models, whose parameters and associate deviation are reported. Ozawa and Kissinger consider global Ea over the whole conversion, estimated as 65.0 kJ/mol with R2 0.8393 and 87.60; these low R2 are due to the several
Ingridy Dayane dos Santos Silva, Nichollas Guimarães Jaques, Janetty Jany Pereira Barros, Renate Maria Ramos Wellen, Renate Maria Ramos Wellen   +4 more
openaire   +2 more sources

Reinforcement of epoxy compounds with fillers

Polymer Mechanics, 1972
The mechanical and physicochemical properties of epoxy compounds containing different amounts of a series of fillers have been investigated. The strength characteristics of compounds with reinforcing fillers improve, starting from very low concentrations, pass through a maximum, and then fall at large concentrations.
Yu. G. Tarasenko, I. A. Uskov, V. V. Nizhnik   +2 more
openaire   +2 more sources

Reactions of Epoxy-compounds by a Radical Mechanism [PDF]

Russian Chemical Reviews, 1970
Data on various methods for the initiation of radical reactions of epoxy-compounds, including their homopolymerisation, are reviewed systematically. The bibliography comprises 134 references.
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Epoxy Compounds for Immobilizing Radioactive Wastes

Atomic Energy, 2005
The radiation resistance of epoxy compounds, solidified by crystalline hardening agents - metaphenyl-enediamine and phthalic anhydride - is investigated. It is shown that under conditions of γ irradiation (E = 1.33 MeV) the temperature of vitrification of the compounds depends on the dose (doses up to 1500 Mrad were investigated) and temperature 20–160°
O. A. Zinov’ev, N. S. Lobanov, P.A. Platonov, V. P. Aleksandrov, O. K. Chugunov, Ya. I. Shtrombakh   +5 more
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Self‐curing epoxy compounds

Journal of Applied Polymer Science, 1990
AbstractA new series including eight structurally different self‐curing epoxy compounds bearing azomethine linkages were synthesized, characterized and polymerized. 4‐(2,3‐Epoxypropoxy)‐benzaldehyde (EPB) or 2,3‐epoxypropyl glyoxylate monohydrate (EPG), prepared by reacting 4‐hydroxybenzaldehyde or glyoxylic acid monohydrate, respectively, with excess ...
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Volume Resistance of Epoxy Molding Compound

2020 China Semiconductor Technology International Conference (CSTIC), 2020
Epoxy molding compound, with excellent electrical insulation and mechanical properties as well as low water absorption, has been widely used in insulation application of generators, motors, transformers, LED drivers and other electrical apparatus. With the power increase of the semiconductor device, the rigid requirement of electrical behavior of ...
Duan Yangyang, Hongjie Liu, Han Jianglong, Cui Liang, Fan Dandan, Lanxia Li, Cheng Xingming, Jiang Xiaojuan, Tan Wei   +8 more
openaire   +2 more sources