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The dielectric strength of epoxy embedding compounds
1962 EI Electrical Insulation Conference Materials and Application, 1962Miniaturization has become a prime design goal especially for airborne electronic components. Generally, this means increased electrical stresses which require both redesign of the insulation system and the introduction of improved materials. To meet these dielectric strength requirements, there has been increased reliance on epoxy embedding compounds.
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Some experiences with epoxy resin grouting compounds
American Industrial Hygiene Association Journal, 1980Epoxy resin systems are used in tiling and grouting in the construction industry. Because of the nature of the application, skin contact is the primary hazard. The most prevalent reaction was reddening of the forearms, followed by whole body reddening and loss of appetite, these latter two being associated with smoking while applying the resin.
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The Reaction of Bisulfite with Epoxy Compounds
Journal of the American Chemical Society, 1953Samuel Kaizerman +1 more
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Conversion of Epoxy Compounds to Conjugated Dienes
Industrial & Engineering Chemistry, 1949J. A. Crowder, A. C. Elm
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Direct Titration of Epoxy Compounds and Aziridines.
Analytical Chemistry, 1964openaire +2 more sources
Intensification of the process of curing epoxy compounds [PDF]
Soviet Materials Science, 1992 A. N. Cherkashina, A. A. Shturman
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Some Effects of Epoxy Compounds on the Blood
Archives of Environmental Health: An International Journal, 1961J. K. Kodama +5 more
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Mutagenic action of epoxy compounds and several alcohols
Mutation Research Letters, 1973openaire +2 more sources