Results 91 to 100 of about 87,071 (315)
The facet‐engineered ZnO/Zn3In2S6 heterostructure, dominated by {001} plane coupling, exposes abundant unsaturated Zn sites with elongated Zn─O bonds, directing photoexcited charge carriers along an S‐scheme pathway and suppressing recombination. Enhanced interfacial Zn adsorption toward bisphenol A and methylene blue further synergistically promotes ...
Yang Yang +6 more
wiley +1 more source
Fluorine‐Free Soft Nanocomposites for High‐Speed Liquid Impact Repellence
Fluorine‐free soft nanocomposite coatings are developed using silicone oil‐mediated mechanical‐stiffness control, enabling ‘dry’ liquid‐repellent surfaces that resist high‐speed water jet impacts up to ∼60 m/s. By tuning nanoparticle loading and oil content, the coatings also achieve >90% optical transparency, amphiphobicity with impact resistance to ...
Priya Mandal +4 more
wiley +1 more source
The use of functionalized epoxy resins (FERs) to improve corrosion resistance in various industrial applications has grown. Covalent and noncovalent modifications are the two main techniques for functionalizing epoxy resins. The addition of hydroxyl (‒OH)
Chandrabhan Verma +2 more
doaj +1 more source
Development of a heterogeneous laminating resin system [PDF]
The factors which effect the impact resistance of laminating resin systems and yet retain equivalent performance with the conventional 450 K curing epoxy matrix systems in other areas were studied.
Biermann, T. F., Hopper, L. C.
core +1 more source
Phosphorus-containing bisimide resins [PDF]
The production of fire-resistant resins particularly useful for making laminates with inorganic fibers such as graphite fibers is discussed. The resins are by (1) condensation of an ethylenically unsaturated cyclic anhydride with a bis(diaminophenyl ...
Fohlen, G. M. +2 more
core +1 more source
Conductive Bonding and System Architectures for High‐Performance Flexible Electronics
This review outlines bonding technologies and structural design strategies that support high‐performance flexible and stretchable electronics. Bonding approaches such as surface‐activated bonding and anisotropic conductive films, together with system‐level architectures including buffer layers and island‐bridge structures, possess distinct mechanical ...
Kazuma Nakajima, Kenjiro Fukuda
wiley +1 more source
Epoxy resins are widely used in the manufacture of composite materials for a wide range of applications. Control of the curing process is an important consideration in ensuring product quality and minimizing production times. The curing of epoxy resin is
Oleg V. Ivanov +2 more
doaj +1 more source
Introducing Chlorine Into Epoxy Resin to Modulate Charge Trap Depth in the Material
Yushun Zhao +4 more
openalex +2 more sources
Imide modified epoxy matrix resins [PDF]
High char yield epoxy using novel bisimide amines (BIA's) as curing agents with a state of the art epoxy resin was developed. Stoichiometric quantities of the epoxy resin and the BIA's were studied to determine the cure cycle required for preparation of ...
Pater, R. H., Scola, D. A.
core +1 more source
Epoxy resins produce improved plastic scintillators [PDF]
Plastic scintillator produced by the substitution of epoxy resins for the commonly used polystyrene is easy to cast, stable at room temperature, and has the desirable properties of a thermoset or cross-linked system.
Markley, F. W.
core +1 more source

