Results 121 to 130 of about 628,978 (424)

The Mechanical Properties of Organic Modified Epoxy Resin

open access: yesThe Annals of “Dunarea de Jos” University of Galati. Fascicle IX, Metallurgy and Materials Science, 2020
Epoxy resins have been presenting a lot of scientific and technical interests and organic modified epoxy resins have recently receiving a great deal of attention.
Georgel MIHU   +4 more
doaj   +1 more source

Evaluation of in-situ shrinkage and expansion properties of polymer composite materials for adhesive anchor systems by a novel approach based on digital image correlation [PDF]

open access: yes, 2019
The curing reaction of thermosetting resins is associated with chemical shrinkage which is overlapped with thermal expansion as a result of the exothermal enthalpy. Final material properties of the polymer are determined by this critical process.
Lichtenegger, Helga C.   +5 more
core   +1 more source

Mechanochromic, Low‐Cost, and Structurally Colored Displays Using Biodegradable Hydroxypropyl Cellulose

open access: yesAdvanced Materials, EarlyView.
Mechanochromic hydroxypropyl cellulose (HPC) integrated with microfluidic devices creates scalable, eco‐friendly reflective color displays. We demonstrate mechanochromic displays with 500 µm pixel size and 5Hz switching rates with room for optimisation. The proposed mechanochromic HPC displays are an initial step toward more environmentally responsible
Charles H. Barty‐King   +4 more
wiley   +1 more source

Bacteriostatic conformal coating and methods of application Patent [PDF]

open access: yes, 1970
Development of bacteriostatic conformal coating and methods of ...
Bland, C., Le Doux, F. N.
core   +1 more source

Two Material Properties from One Wavelength‐Orthogonal Photoresin Enabled by a Monochromatic Laser Integrated Stereolithographic Apparatus (Mono LISA)

open access: yesAdvanced Materials, Volume 37, Issue 13, April 2, 2025.
A single object with dual properties – degradable and non‐degradable – is fabricated in a single print simply by switching the printing colors. The advanced multi‐material printing is enabled by the combination of a fully wavelength‐orthogonal photoresin and a monochromatic tunable laser printer, paving the way for precise multi‐material ...
Xingyu Wu   +5 more
wiley   +1 more source

Review of thermal conductivity in epoxy thermosets and composites: Mechanisms, parameters, and filler influences

open access: yesAdvanced Industrial and Engineering Polymer Research
Rapid development of energy, electrical and electronic technologies has put forward higher requirements for the thermal conductivities of epoxy resins and their composites. However, the thermal conductivity of conventional epoxy resins is relatively low,
Mei-Hui Zhou   +2 more
doaj  

Development of a heterogeneous laminating resin system [PDF]

open access: yes
The factors which effect the impact resistance of laminating resin systems and yet retain equivalent performance with the conventional 450 K curing epoxy matrix systems in other areas were studied.
Biermann, T. F., Hopper, L. C.
core   +1 more source

Fluoroether modified epoxy composites [PDF]

open access: yes, 1983
Addition of controlled amounts of perfluorinated alkyl ether diacyl fluoride to epoxy resin systems prior to cure results in a formulation which, exhibits improved energy absorbing ...
Rosser, R. W., Taylor, M. S.
core   +1 more source

Liquid Metal‐Vitrimer Conductive Composite for Recyclable and Resilient Electronics

open access: yesAdvanced Materials, EarlyView.
To address the growing electronic waste challenge, an electrically conductive, healable, and recyclable plastic composite is created, composed of vitrimer and liquid metal microdroplets. A reconfigurable circuit board is demonstrated using this composite material, providing a notable step toward sustainable and robust electronic technologies.
Dong Hae Ho   +4 more
wiley   +1 more source

Selection of High Strength Encapsulant for MEMS Devices Undergoing High Pressure Packaging [PDF]

open access: yesDans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007), 2008
Deflection behavior of several encapsulant materials under uniform pressure was studied to determine the best encapsulant for MEMS device. Encapsulation is needed to protect movable parts of MEMS devices during high pressure transfer molded packaging process.
arxiv  

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