Results 191 to 200 of about 1,945,411 (275)

A New Lower Bound for Noisy Permutation Channels via Divergence Packing. [PDF]

Entropy (Basel)
Feng L, Lv G, Li X, Jin Y.
europepmc   +1 more source

Understanding the Stochastic Nature of Process Parameter Development of Blown Powder Laser Beam Directed Energy Deposition Additive Manufacturing of Pure Molybdenum

Advanced Engineering Materials, EarlyView.
Identified through the use of statistical design of experiments and metallographic investigation, this study exposes the stochastic origins of intergranular cracks in blown powder laser beam directed energy deposition additive manufacturing of pure molybdenum. It further demonstrates a successful crack mitigation approach with direct correlation to the
Nathaniel J. Lies, Daniel E. Driemeyer, Aaron P. Stebner   +2 more
wiley   +1 more source

Comparison of Biportal and Uniportal Spine Endoscopy for Effectiveness and Perioperative Safety: A Systematic Review and Meta-Analysis. [PDF]

Cureus
Singh S, Kumar P, Priyanka P, Masina S, Pandey SD, Halemani K.   +5 more
europepmc   +1 more source

Microstructure Evolution of a VMnFeCoNi High‐Entropy Alloy After Synthesis, Swaging, and Annealing

Advanced Engineering Materials, EarlyView.
The synthesis and processing (rotary swaging and annealing) of the novel VMnFeCoNi alloy is investigated, alongside the estimation of the grain size effect on hardness. Analysis of a wide grain size range of recrystallized microstructures (12–210 µm) reveals a low annealing twin density.
Aditya Srinivasan Tirunilai, Zeki Ayrildi, Buse Şen, Maik Rajkowski, Mathias Redondo Garcia, Markus Stricker, Guillaume Laplanche   +6 more
wiley   +1 more source

Feature binding and error commission. [PDF]

Atten Percept Psychophys
Foerster A, Linz S, Moeller B, Nemeth M, Frings C, Pfister R.   +5 more
europepmc   +1 more source

Tailoring Functional Properties of Ti–Ni–Cu Shape Memory Alloy Thin Films for MEMS Actuators

Advanced Engineering Materials, EarlyView.
A comprehensive study of critical parameters required to develop well‐performing Ti–Ni–Cu thin film shape memory alloy microactuators is provided. Materials science and device integration aspects are integrated by addressing structural and physical relationships using complementary characterization techniques as well as a practical fabrication solution
Elaheh Akbarnejad, Aleksander Kostka, Gowtham Arivanandhan, Yujiao Li, Alan Savan, Manfred Kohl, Alfred Ludwig   +6 more
wiley   +1 more source

PASTA‐ELN: Simplifying Research Data Management for Experimental Materials Science

Advanced Engineering Materials, EarlyView.
Research data management faces ongoing hurdles as many ELNs remain complex and restrictive. PASTA‐ELN offers an open‐source, cross‐platform solution that prioritizes simplicity, offline access, and user control. Its in tuitive folder structure, modular Python add‐ons, and open formats enable seamless documentation, FAIR data practices, and easy ...
S. Brinckmann, G. Winkens, R. Schwaiger
wiley   +1 more source

Competition between radiative and predissociative decay mechanisms in excited electronic states of CH radical.

Phys Chem Chem Phys
Sokolov A, Yurchenko SN, Tennyson J.
europepmc   +1 more source

Inf-sup stable space-time Local Discontinuous Galerkin method for the heat equation. [PDF]

J Sci Comput
Gómez S, Perinati C, Stocker P.
europepmc   +1 more source

Evaluation of Plasticity and Creep Parameters From Tensile Stress–Strain Data for a Range of Strain Rates

Advanced Engineering Materials, EarlyView.
This plot compares experimental tensile stress–strain curves (with 4 different strain rates) and corresponding modelled curves (obtained using the optimised sets of Voce and Miller–Norton parameter values shown). The inferred M‐N values, characterizing the creep, are very similar to those obtained via conventional creep testing.
S. Ooi, R. P. Thompson, T. W. Clyne
wiley   +1 more source