Results 141 to 150 of about 150,683 (215)

Sputtering yield for metal halide perovskite devices patterning. [PDF]

Sci Technol Adv Mater
Wu E, Tsarev S, Liu X, Proniakova D, Yakunin S, Kovalenko MV, Shorubalko I.   +6 more
europepmc   +1 more source

Simulations of Novel Semi-Spherical Electrode Detectors Formed by Simultaneously Deep-Etched Trenches. [PDF]

Micromachines (Basel)
Wang H, Li Z.
europepmc   +1 more source

Porous Au/Ti Bilayer Thin-Film Getters Based on Black Silicon for MEMS Vacuum Packaging. [PDF]

Micromachines (Basel)
Zhao K, Chen T, Liu Y, Fan J.
europepmc   +1 more source

Reversible Thickness Engineering in Amorphous In₂O₃ Transistors. [PDF]

Nano Lett
Pan YY, Hsu CH, Tseng R, Wang ST, Chang YC, Chen SC, Kimura T, Lan YW, Lien DH.   +8 more
europepmc   +1 more source

AI-driven feature recognition of SEM profiles in deep reactive ion etching based on physics-constrained variational autoencoder. [PDF]

Microsyst Nanoeng
Wang F, Yu H, Miao Y, Sun K, Sun Y, Yang H, Li X.   +6 more
europepmc   +1 more source

Toward a Functional and Conceptual Framework for Adhesive Materials: The Role of Etching Technique. [PDF]

Dent J (Basel)
Muñoz MA, Luque-Martinez I.
europepmc   +1 more source

Oxygen Plasma-Modified Graphene Composite Membranes for Enhanced Forward Osmosis Performance: Mitigating Reverse Salt Flux and Improving Permeability. [PDF]

Membranes (Basel)
Zhang K, Wu Y, Jiang Y, Han Q, Zhang M, Feng L, Zhang L.   +6 more
europepmc   +1 more source

A review of glass thermal reflow: method, device, and applications. [PDF]

Microsyst Nanoeng
Zhu M, Shi P, Zhang G, Yan C, Chen F, Liu S, Lian R, Zhu K, Dai H, Wu H, Liu Y, Li B, Du X, Xue G.   +13 more
europepmc   +1 more source

3D reconstruction and etching profile simulation for wiggling active area effect in dynamic random access memory manufacturing. [PDF]

Commun Eng
Hu Z, Wen J, Yang C, Shao H, Zhai Y, Ge R, He X, Men Z, Yang Y, Sun D, Liu Z, Shang D, Li Z, Li J, Filipovic L, Chen R, Li L.   +16 more
europepmc   +1 more source