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2008
Deep reactive ion etching (DRIE) of silicon, notably the Bosch DRIE process, has virtually changed microsystem technology over the past decade. Since then, a wide variety of silicon-based microsystems have been implemented in high-volume industrial applications. An important example is inertial sensors for measuring acceleration and yaw rate.
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Deep reactive ion etching (DRIE) of silicon, notably the Bosch DRIE process, has virtually changed microsystem technology over the past decade. Since then, a wide variety of silicon-based microsystems have been implemented in high-volume industrial applications. An important example is inertial sensors for measuring acceleration and yaw rate.
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Metal‐Assisted Chemical Etching of Silicon: A Review
Advances in Materials, 2011Zhipeng Huang +4 more
semanticscholar +1 more source
Preparation of Ti3C2 and Ti2C MXenes by fluoride salts etching and methane adsorptive properties
, 2017Fanfan Liu +6 more
semanticscholar +1 more source
Electrochemical etching of Ti2AlC to Ti2CTx (MXene) in low-concentration hydrochloric acid solution
, 2017Wanmei Sun +7 more
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