Results 121 to 130 of about 689,888 (317)
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan+5 more
wiley +1 more source
The use of multithreading for exception handling [PDF]
C.B. Zilles, J.S. Emer, G.S. Sohi
openalex +1 more source
Residual Stress States in Microstructurally Graded PBF–LB/M Austenitic Steel Components
This study examines microstructurally graded 316L rectangular tube profiles fabricated via PBF–LB/M using a dual‐laser system. A 1 kW top‐hat and a 400 W Gaussian laser create distinct grain sizes and crystallographic texture. Mechanical properties are linked to microstructural evolution driven by processing conditions.
Nico Möller+5 more
wiley +1 more source
Revisiting Grudin’s eight challenges for developers of groupware technologies 30 years later
In 1994, Jonathan Grudin wrote his famous paper Eight Challenges for Groupware Developers; The question is whether these challenges still persist, or have we moved on here 30 years later?
Duckert Melanie, Bjørn Pernille
doaj +1 more source
Software that Learns from its Own Failures
All non-trivial software systems suffer from unanticipated production failures. However, those systems are passive with respect to failures and do not take advantage of them in order to improve their future behavior: they simply wait for them to happen ...
Monperrus, Martin
core
This study presents a hyperelastic mechanical metamaterial for elastic energy dissipation. Energy is dissipated within its unit cells by friction assisted by material damping. Frictional contact is enhanced when using auxetic unit cells. The load–displacement plot for one compression cycle shows a pronounced hysteresis loop, indicating that a large ...
Eunhyeuk Jeong+2 more
wiley +1 more source
Exception Handling Within Workflow-Based Web Applications [PDF]
Marco Brambilla, Nicola D’Elia
openalex +1 more source
Experiments for reinforcing the diffusion bonding plane by the oxide dispersion strengthening effect are presented. Small ceramic particles (0.5 and 50 μm, respectively) are incorporated. Furthermore, ceramic particles help to penetrate stable passivation layers, enabling atomic diffusion across bonding planes. Since a ceramic–metallic interface cannot
Thomas Gietzelt+4 more
wiley +1 more source
Revisiting Exception Handling Practices with Exception Flow Analysis [PDF]
Guilherme B. de Pádua, Weiyi Shang
openalex +3 more sources
A systematic approach for structuring exception handling in robust component-based software [PDF]
Fernando Castor+3 more
openalex +1 more source