Results 141 to 150 of about 3,048,635 (228)

Descriptors to Dynamics: A Materials and Device Perspective on in‐Materio Physical Reservoir Computing for Neuromorphic Edge Intelligence

open access: yesAdvanced Materials, EarlyView.
Intrinsic material dynamics are harnessed as computational resources for neuromorphic in‐materio physical reservoir computing. Defects, ionic motion, interfaces, percolation, geometry, and biasing shape transient states that provide fading memory, nonlinearity, and high‐dimensional projection for simple readout. A descriptor‐to‐dynamics framework links
Kshitij RB Singh   +5 more
wiley   +1 more source

Dual‐State Programmable Oxide Transistor for Time‐Based Cryptography

open access: yesAdvanced Materials, EarlyView.
A DUPOT enables independently tunable Vth and Isat depending on gate bias polarity, producing three‐dimensional dynamical behavior within a transfer characteristic. This behavior originates from charge trapping and oxygen‐ion migration in the HfO2 layer.
Huisu Noh   +9 more
wiley   +1 more source

Tamper‐Responsive Physical Unclonable Functions via Graphene‐Interlayered Block Copolymer Random Structures

open access: yesAdvanced Materials, EarlyView.
Self‐invalidating multilayer physical unclonable functions (PUFs) integrate fingerprint‐like metal nanopattern bilayers from block copolymer templates with highly reactive reduced graphene oxide (rGO) interlayers. This tamper‐responsive architecture blocks all unauthorized physical and chemical replication attempts while autonomously deactivating ...
Gyu Hui Jo   +7 more
wiley   +1 more source

Life‐Like Ferrous Oxide Microspheres from Kombucha

open access: yesAdvanced Materials Interfaces, EarlyView.
Kombucha bacterial cellulose, sodium alginate, and ferrous nitrate self‐assemble into membrane‐enclosed iron oxide microspheres. These microspheres bud daughter vesicles, sustain 24‐h electrochemical oscillations, and filter theta‐band signals.
Panagiotis Mougkogiannis   +2 more
wiley   +1 more source

Recent Advances in Plasma‐Enhanced Atomic Layer Etching for Next‐Generation Nanofabrication

open access: yesAdvanced Materials Interfaces, EarlyView.
Continued semiconductor miniaturization demands atomic‐scale patterning and ultralow surface roughness beyond the capabilities of conventional reactive ion etching. This review highlights advances in isotropic and anisotropic plasma‐enhanced atomic layer etching since 2020, covering fundamental mechanisms, applications across major semiconductor ...
Shih‐Nan Hsiao
wiley   +1 more source

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