Results 281 to 290 of about 2,258,539 (385)

Versatile Selective Soldering via Molten Metal Printing for Heat‐Sensitive 3D Electronics and Smart Wearables

open access: yesAdvanced Functional Materials, EarlyView.
Selective soldering via molten metal printing enables component integration, even in heat‐sensitive applications across fields like additive manufacturing, sustainable electronics, and smart textiles. This method overcomes the temperature limitations of existing technologies.
Dániel Straubinger   +4 more
wiley   +1 more source

High‐Performance Low‐Emissivity Paints Enabled by N‐Doped Poly(benzodifurandione) (n‐PBDF) for Energy‐Efficient Buildings

open access: yesAdvanced Functional Materials, EarlyView.
This study introduces a scalable and colored low‐emissivity (low‐e) paint achieved by spraying an ultrathin n‐doped poly(benzodifurandione) (n‐PBDF) coating onto various colored substrates. The low‐e paint enhances thermal regulation by reducing mid‐infrared thermal emissivity to 0.19, thereby stabilizing indoor temperatures across diverse climates ...
Xiaojie Liu   +13 more
wiley   +1 more source

Fabrication and validation of an affordable DIY coaxial 3D extrusion bioprinter. [PDF]

open access: yesSci Rep
Jergitsch M   +7 more
europepmc   +1 more source

Print‐and‐Plate Architected Electrodes for Electrochemical Transformations Under Flow

open access: yesAdvanced Functional Materials, EarlyView.
Typical flow cell electrodes are composed of stochastic porous carbon, limiting understanding of electrode structure‐performance relationships. This work describes an approach, termed “print‐and‐plate,” to prepare porous electrodes by direct ink writing followed by conformal metal coating.
Dylan M. Barber   +12 more
wiley   +1 more source

Harnessing Outer Space for Improved Electrocaloric Cooling

open access: yesAdvanced Functional Materials, EarlyView.
A novel radiative heat sink/source‐integrated electrocaloric (R‐iEC) system combines the electrocaloric (EC) effect with a thermally conductive radiative cooler (TCRC) to address heat dissipation limitations in EC devices. Utilizing outer space as a heat sink, the system achieves up to 240 W m−2 of heat dissipation performance, making it highly ...
Dong Hyun Seo   +8 more
wiley   +1 more source

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